5SGSED6K1F40C2N

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA

Quantity 1,059 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSED6K1F40C2N – Stratix V GS FPGA, 1517-BBGA

The 5SGSED6K1F40C2N is a Stratix V GS field-programmable gate array (FPGA) in a 1517-BBGA FCBGA package. It combines a high logic density fabric with abundant variable-precision DSP resources and integrated high-speed transceivers, targeting transceiver-based, DSP-centric designs.

Built on Stratix V family architecture (28‑nm process), this device is positioned for bandwidth- and data-intensive applications where on-chip memory, DSP throughput, and flexible I/O are required.

Key Features

  • Logic Capacity  Approximately 583,000 logic elements to implement large-scale logic and control functions.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM (total RAM bits: 46,080,000) for buffering, packet storage, and intermediate DSP data.
  • Variable‑Precision DSP Blocks  Stratix V GS family devices include an abundance of variable precision DSP resources (family-level support for up to 3,926 18×18 or 1,963 27×27 multipliers) to accelerate high-performance signal processing.
  • Integrated High‑Speed Transceivers  Family-level support for integrated transceivers with 14.1‑Gbps data‑rate capability, enabling backplane and optical interface connectivity for high-bandwidth systems.
  • I/O and Package  696 I/O pins in a 1517‑BBGA (1517‑FBGA, 40×40) FCBGA package for dense system integration and board-level routing.
  • Core Supply Range  Specified core voltage range: 870 mV to 930 mV.
  • Operating Grade and Temperature  Commercial grade, with an operating temperature range of 0 °C to 85 °C.
  • Embedded HardCopy Block  Includes an Embedded HardCopy Block for hardened IP instantiation (family-level support for PCIe Gen3/Gen2/Gen1 hard IP integration and migration to HardCopy V ASICs).
  • Process Technology  Stratix V family devices are built on 28‑nm TSMC process technology.
  • RoHS Compliant  Meets RoHS environmental compliance requirements.

Typical Applications

  • High‑performance DSP systems  Use the device's variable-precision DSP blocks and large on-chip memory for compute-intensive signal processing and real-time analytics.
  • Optical and backplane communications  Integrated transceivers with 14.1‑Gbps capability enable implementation of 40G/100G and other high-bandwidth optical and backplane interfaces.
  • Packet processing and traffic management  High logic density and ample memory support complex packet inspection, queuing, and traffic-management pipelines.
  • Prototyping and ASIC migration  Embedded HardCopy Block and Stratix V family flow enable low-risk prototyping with a production migration path to HardCopy V ASICs.

Unique Advantages

  • High logic density: 583,000 logic elements provide the headroom to implement large FPGA designs without partitioning across multiple devices.
  • Substantial on‑chip memory: Approximately 46 Mbits of embedded RAM reduce external memory dependencies and lower system latency for buffering and data staging.
  • DSP-optimized architecture: Family-level support for thousands of dedicated multipliers accelerates filtering, transforms, and other numeric workloads.
  • Transceiver-enabled connectivity: 14.1‑Gbps capable transceivers support high-speed serial protocols for demanding communications applications.
  • Dense I/O in compact package: 696 I/Os in a 1517-BBGA FCBGA footprint simplify integration into space-constrained boards while providing extensive external connectivity.
  • Commercial-grade robustness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose 5SGSED6K1F40C2N?

The 5SGSED6K1F40C2N delivers a balance of high logic capacity, significant on-chip memory, DSP resources, and transceiver-enabled connectivity within a compact FCBGA package. It is suited to engineers building transceiver-centric, DSP-heavy systems where integration density and on-chip compute and memory reduce system complexity.

As part of the Stratix V GS family on a 28‑nm process with Embedded HardCopy Blocks, this device supports prototyping and a migration path to hardened ASIC implementations, offering scalability from development to production.

Request a quote or submit an inquiry for pricing, availability, and lead-time details for the 5SGSED6K1F40C2N. Our team will provide the information needed to evaluate this FPGA for your design.

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