5SGSED6K1F40C2G

The 5SGSED6K1F40C2G is a Stratix V GS family FPGA offering high-density programmable logic and a large I/O complement in a 1517-BBGA FCBGA package. Key on-chip resources include 583,000 logic elements and approximately 46.08 Mbits of embedded memory, making the device suitable for complex, resource-intensive designs.

This device is supplied in a commercial temperature grade (0 °C to 85 °C) and is RoHS compliant. It is designed for surface-mount assembly and operates from a core voltage supply range of 870 mV to 930 mV, supporting designs that require substantial logic capacity and high pin counts (696 I/Os).

Key Features

• High-density programmable logic — 583,000 logic elements to implement large-scale combinational and sequential logic.
• Embedded memory — Approximately 46.08 Mbits of on-chip RAM to support buffering, state machines, and large data structures.
• Extensive I/O — 696 I/Os to support complex external interfacing and multi-channel connectivity.
• Package and mounting — 1517-BBGA (FCBGA) supplier device package 1517-FBGA (40×40); surface-mount mounting for board-level integration.
• Power — Core voltage supply range 870 mV to 930 mV for defined power domain planning.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C for general-purpose and commercial deployments.
• Regulatory — RoHS compliant.

Typical Applications

• Custom FPGA-based systems — Use the device’s large logic element count and embedded memory to implement bespoke digital processing and control architectures.
• High-pin-count interfaces — The 696 I/Os enable integration with multiple peripherals, front-end modules, and parallel interfaces.
• Data buffering and on-chip storage — Approximately 46.08 Mbits of embedded RAM supports frame buffering, FIFOs, and data staging within the FPGA fabric.

Unique Advantages

• Large programmable capacity — 583,000 logic elements reduce the need for external logic, enabling complex designs on a single device.
• Significant on-chip memory — Approximately 46.08 Mbits of embedded RAM helps consolidate memory needs on-die and streamline board design.
• High I/O density — 696 I/Os provide flexibility for multi-channel and multi-protocol system topologies without additional I/O expanders.
• Commercial operating range — Rated 0 °C to 85 °C for mainstream commercial applications.
• Surface-mount FCBGA packaging — 1517-BBGA packaging supports compact board layouts and high pin-count routing.
• Compliance — RoHS compliant for environmentally constrained BOM requirements.

Why Choose 5SGSED6K1F40C2G?

The 5SGSED6K1F40C2G delivers a balance of high logic density, substantial embedded memory, and very high I/O count in a commercial-grade Stratix V GS FPGA package. These characteristics make it well suited to designs that require consolidated programmable logic, extensive on-chip data storage, and broad external connectivity while maintaining a defined commercial operating range and RoHS compliance.

Designers and procurement teams looking for a high-capacity FPGA with clearly defined electrical and mechanical parameters—such as core supply range, package type, and operating temperature—can leverage this device where on-die resources and I/O density directly support system integration and BOM reduction.

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