5SGSED6K1F40C2L

The 5SGSED6K1F40C2L is a Stratix V GS field programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package for surface-mount assembly. It is built on 28‑nm process technology and targets transceiver‑based, DSP‑centric applications that require high logic capacity, abundant embedded memory, and integrated high‑speed transceivers.

Typical markets and use cases for this GS variant include wireline, broadcast, military, and high‑performance computing where integrated DSP resources and transceiver bandwidth support data‑intensive processing and protocol interfacing.

Key Features

• Core and fabric: Built on 28‑nm TSMC process technology with a redesigned adaptive logic module (ALM) and multi‑track routing architecture; device contains 583,000 logic elements.
• Embedded memory: Approximately 46 Mbits of embedded memory implemented with 20 Kbit (M20K) memory blocks for large on‑chip buffering and state storage.
• DSP resources: Variable‑precision DSP blocks supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high‑performance digital signal processing workloads.
• High‑speed transceivers: Integrated transceivers with 14.1‑Gbps data‑rate capability (Stratix V GS devices) suitable for backplane and optical interface applications.
• I/O and package: 696 user I/O pins in a 1517‑BBGA (supplier package listed as 1517‑FBGA, 40×40) surface‑mount package for dense board integration.
• Clocking and IP: Fractional PLLs and an Embedded HardCopy Block that supports hardened IP instantiation for PCIe Gen3/Gen2/Gen1.
• Power and operating range: Core supply range of 0.820 V to 0.880 V and commercial operating temperature range of 0 °C to 85 °C.
• Manufacturing and supply: RoHS compliant.

Typical Applications

• Transceiver‑based DSP systems: High‑precision digital signal processing using abundant DSP multipliers and on‑chip memory for algorithms such as filtering, FFTs, and channel processing.
• Optical and backplane interfaces: Use of integrated 14.1‑Gbps transceivers for optical transport and high‑speed backplane links.
• Packet processing and traffic management: Logic capacity and memory resources to implement high‑throughput packet pipelines and buffering.
• Prototyping for ASIC conversion: Stratix V FPGAs can be used for prototyping with a defined path to HardCopy V ASICs for higher volume production.

Unique Advantages

• Large logic capacity: 583,000 logic elements enable complex designs and large FPGA-based systems without immediate partitioning across devices.
• Substantial on‑chip memory: Approximately 46 Mbits of embedded memory reduces external memory dependence and lowers system BOM complexity.
• Dedicated DSP throughput: Thousands of variable‑precision DSP multipliers deliver the arithmetic density required for compute‑intensive signal processing.
• Integrated high‑speed I/O: 696 I/O pins and built‑in 14.1‑Gbps transceivers simplify high‑bandwidth interface implementation and board routing.
• Integrated hardened IP options: Embedded HardCopy Block for PCIe IP hardening helps reduce redesign risk when implementing standard protocols.
• Commercial temperature and low‑voltage core: Designed for 0 °C to 85 °C operation with a 0.820–0.880 V core supply to match system power planning.

Why Choose 5SGSED6K1F40C2L?

The 5SGSED6K1F40C2L positions itself as a high‑capacity, DSP‑oriented Stratix V GS device that combines extensive logic, significant embedded memory, and integrated transceivers in a compact 1517‑BBGA surface‑mount package. Its architecture and feature set make it suitable for designers implementing data‑intensive signal processing, high‑speed communications interfaces, and prototype‑to‑ASIC development flows.

For engineering teams and procurement looking for a commercial‑grade FPGA with a balance of logic density, on‑chip memory, DSP resources, and high‑speed I/O, this Stratix V GS device offers a verifiable specification set and support for production migration to HardCopy V ASICs.

Request a quote or submit a purchase inquiry to evaluate 5SGSED6K1F40C2L for your next design.