5SGSED8K1F40I2N

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA

Quantity 930 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8K1F40I2N – Stratix V GS FPGA, 695,000 Logic Elements, 1517-FBGA

The 5SGSED8K1F40I2N is an Intel Stratix® V GS field-programmable gate array in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package. This industrial-grade device combines high logic density, abundant embedded memory, and a large I/O count to address DSP-centric and transceiver-based system requirements.

Designed for bandwidth- and compute-intensive applications, the device leverages Stratix V family architecture elements—including adaptive logic modules, M20K embedded memory blocks, and integrated high-speed transceivers—to deliver a scalable platform for high-performance signal processing and communications designs.

Key Features

  • Core and Process  28-nm Stratix V architecture with documented family features such as adaptive logic modules and comprehensive fabric clocking.
  • Logic Capacity  695,000 logic elements for complex, high-density designs.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM organized in M20K memory blocks for large data buffering and frame storage.
  • DSP Resources  Stratix V GS family devices include variable-precision DSP blocks (family-level specification: support for up to 3,926 18×18 or 1,963 27×27 multipliers), enabling high-precision digital signal processing workflows.
  • High-Speed Transceivers & I/O  696 I/O pins and integrated transceiver capability consistent with Stratix V GS family transceivers (family-level data reports 14.1 Gbps capability) for backplane and optical interface applications.
  • Power  Documented supply window of 870 mV to 930 mV for core operation.
  • Package & Mounting  1517-BBGA (supplier package: 1517-FBGA, 40×40) surface-mount package optimized for dense board-level integration.
  • Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C.
  • System IP and Clocking  Family-level features include fractional PLLs and an Embedded HardCopy block for hardened IP instantiations such as PCIe—useful when migrating from FPGA prototype to ASIC in production.
  • Standards & Compliance  RoHS compliant.

Typical Applications

  • High-Performance DSP  Real-time signal processing, filtering, and compute-heavy algorithms that benefit from variable-precision DSP blocks and large on-chip memory.
  • Optical and Backplane Communications  Transceiver-capable interfaces and high I/O density make the device suitable for 40G/100G transport, backplane switching, and optical test equipment.
  • Network Packet Processing  Packet inspection, traffic management, and line-rate processing where high logic density and embedded memory accelerate throughput.
  • Broadcast and High-Performance Computing  Video processing, encoding/decoding, and compute-accelerated workloads that require dense DSP and memory resources.
  • Prototyping for ASIC Migration  Use as a production-prototype platform with a defined path to HardCopy V ASICs for higher-volume designs (family-level capability).

Unique Advantages

  • High Logic Density: 695,000 logic elements provide the capacity to implement complex state machines, datapaths, and custom compute engines on a single device.
  • Substantial On-Chip Memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependence and simplifies board design for buffering and frame storage.
  • Robust DSP Fabric: Family-level DSP multiplier support enables precision and throughput for demanding signal-processing pipelines.
  • Large I/O Count: 696 I/O pins accommodate wide parallel interfaces, multi-lane transceiver endpoints, and rich peripheral connectivity.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation and RoHS compliant for deployment in industrial environments.
  • Low-Voltage Core Operation: Documented supply range (870–930 mV) supports low-voltage system architectures.

Why Choose 5SGSED8K1F40I2N?

The 5SGSED8K1F40I2N combines Stratix V family architectural strengths—high logic density, extensive embedded memory, DSP-focused resources, and transceiver-capable I/O—in a single industrial-grade BGA package. It is well suited for engineers building high-throughput communications, DSP, and prototyping platforms that require integrated, scalable silicon.

Backed by Stratix V family documentation and a defined migration path to hardened ASICs (HardCopy V), this FPGA offers a clear lifecycle for designs that start with FPGA prototyping and evolve toward production deployments.

Request a quote or submit a purchase inquiry to receive pricing and availability for the 5SGSED8K1F40I2N.

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