5SGSED8K2F40C3N

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA

Quantity 363 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8K2F40C3N – Stratix® V GS Field Programmable Gate Array (FPGA)

The 5SGSED8K2F40C3N is a Stratix V GS FPGA in a 1517-BBGA FCBGA package, designed for high-density logic, DSP-intensive processing, and transceiver-enabled systems. Built on a 28‑nm architecture, this device targets bandwidth- and DSP-centric applications where large logic capacity, abundant embedded memory, and high I/O count are required.

Key capabilities include approximately 695,000 logic elements, roughly 51.2 Mbits of embedded RAM, integrated transceivers with 14.1‑Gbps capability (Stratix V GS variant), and up to 696 I/O pins—making it suitable for demanding communications, networking, and high‑performance compute applications.

Key Features

  • Core architecture — 28‑nm Stratix V architecture optimized for high logic density and DSP integration; device variant (GS) focuses on DSP and transceiver balance.
  • Logic capacity — Approximately 695,000 logic elements to implement large, complex FPGA designs.
  • Embedded memory — Approximately 51.2 Mbits of on‑chip RAM (M20K blocks) to support buffering, look‑up tables, and data storage for processing pipelines.
  • Variable‑precision DSP — GS devices support up to 3,926 18×18 or 1,963 27×27 multipliers for high‑precision, high‑throughput digital signal processing.
  • Integrated transceivers — Transceiver capability up to 14.1 Gbps on the Stratix V GS variant for backplane and optical interface applications.
  • I/O and packaging — 696 user I/O pins in a 1517‑BBGA (1517‑FBGA, 40×40) surface‑mount package for dense routing and board‑level integration.
  • Power — Core supply range specified at 820 mV to 880 mV to support the device’s operating requirements.
  • Operating conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • High‑speed communications — Implement PCIe and other bandwidth‑centric protocols and line cards that require large logic capacity and transceiver interfaces.
  • Data center and networking — Support 40G/100G class data paths and packet processing where large embedded memory and numerous I/Os are needed.
  • High‑performance DSP — Handle compute‑heavy signal processing such as broadcast, wireline, and scientific processing using the device’s abundant DSP multipliers.
  • Prototype to production ASIC path — Use the Stratix V FPGA for prototyping with an available low‑risk path to HardCopy V ASICs for volume production.

Unique Advantages

  • High logic density: Approximately 695,000 logic elements enable large-scale FPGA implementations without partitioning across multiple devices.
  • Substantial on‑chip RAM: Approximately 51.2 Mbits of embedded memory reduces external memory dependence and simplifies board design.
  • DSP performance: Up to 3,926 18×18 or 1,963 27×27 multipliers provide scalable, variable‑precision arithmetic for demanding signal‑processing workloads.
  • Transceiver integration: 14.1‑Gbps transceiver capability on GS devices supports high‑bandwidth serial links for backplane and optical interfaces.
  • Large I/O complement: 696 I/O pins in a 1517‑FBGA (40×40) package supports complex system interfaces and dense board routing.
  • Commercial readiness and compliance: Surface‑mount package, commercial operating range (0 °C to 85 °C), and RoHS compliance simplify supply and integration for mainstream products.

Why Choose 5SGSED8K2F40C3N?

The 5SGSED8K2F40C3N positions itself for designs that require a balance of very large logic capacity, extensive DSP resources, significant embedded memory, and high‑speed transceiver capability. Its Stratix V GS architecture is tailored to bandwidth‑centric and DSP‑centric systems where on‑chip resources and a high I/O count reduce system complexity and board-level BOM.

For teams developing networking equipment, communications interfaces, or high‑performance processing engines, this device offers a clear prototyping route and a documented path to volume ASIC conversion via HardCopy V, supporting both development flexibility and longer‑term production planning.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGSED8K2F40C3N Stratix V GS FPGA.

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