5SGSED8K2F40C3N
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 363 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSED8K2F40C3N – Stratix® V GS Field Programmable Gate Array (FPGA)
The 5SGSED8K2F40C3N is a Stratix V GS FPGA in a 1517-BBGA FCBGA package, designed for high-density logic, DSP-intensive processing, and transceiver-enabled systems. Built on a 28‑nm architecture, this device targets bandwidth- and DSP-centric applications where large logic capacity, abundant embedded memory, and high I/O count are required.
Key capabilities include approximately 695,000 logic elements, roughly 51.2 Mbits of embedded RAM, integrated transceivers with 14.1‑Gbps capability (Stratix V GS variant), and up to 696 I/O pins—making it suitable for demanding communications, networking, and high‑performance compute applications.
Key Features
- Core architecture — 28‑nm Stratix V architecture optimized for high logic density and DSP integration; device variant (GS) focuses on DSP and transceiver balance.
- Logic capacity — Approximately 695,000 logic elements to implement large, complex FPGA designs.
- Embedded memory — Approximately 51.2 Mbits of on‑chip RAM (M20K blocks) to support buffering, look‑up tables, and data storage for processing pipelines.
- Variable‑precision DSP — GS devices support up to 3,926 18×18 or 1,963 27×27 multipliers for high‑precision, high‑throughput digital signal processing.
- Integrated transceivers — Transceiver capability up to 14.1 Gbps on the Stratix V GS variant for backplane and optical interface applications.
- I/O and packaging — 696 user I/O pins in a 1517‑BBGA (1517‑FBGA, 40×40) surface‑mount package for dense routing and board‑level integration.
- Power — Core supply range specified at 820 mV to 880 mV to support the device’s operating requirements.
- Operating conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
Typical Applications
- High‑speed communications — Implement PCIe and other bandwidth‑centric protocols and line cards that require large logic capacity and transceiver interfaces.
- Data center and networking — Support 40G/100G class data paths and packet processing where large embedded memory and numerous I/Os are needed.
- High‑performance DSP — Handle compute‑heavy signal processing such as broadcast, wireline, and scientific processing using the device’s abundant DSP multipliers.
- Prototype to production ASIC path — Use the Stratix V FPGA for prototyping with an available low‑risk path to HardCopy V ASICs for volume production.
Unique Advantages
- High logic density: Approximately 695,000 logic elements enable large-scale FPGA implementations without partitioning across multiple devices.
- Substantial on‑chip RAM: Approximately 51.2 Mbits of embedded memory reduces external memory dependence and simplifies board design.
- DSP performance: Up to 3,926 18×18 or 1,963 27×27 multipliers provide scalable, variable‑precision arithmetic for demanding signal‑processing workloads.
- Transceiver integration: 14.1‑Gbps transceiver capability on GS devices supports high‑bandwidth serial links for backplane and optical interfaces.
- Large I/O complement: 696 I/O pins in a 1517‑FBGA (40×40) package supports complex system interfaces and dense board routing.
- Commercial readiness and compliance: Surface‑mount package, commercial operating range (0 °C to 85 °C), and RoHS compliance simplify supply and integration for mainstream products.
Why Choose 5SGSED8K2F40C3N?
The 5SGSED8K2F40C3N positions itself for designs that require a balance of very large logic capacity, extensive DSP resources, significant embedded memory, and high‑speed transceiver capability. Its Stratix V GS architecture is tailored to bandwidth‑centric and DSP‑centric systems where on‑chip resources and a high I/O count reduce system complexity and board-level BOM.
For teams developing networking equipment, communications interfaces, or high‑performance processing engines, this device offers a clear prototyping route and a documented path to volume ASIC conversion via HardCopy V, supporting both development flexibility and longer‑term production planning.
Request a quote or submit an inquiry to receive pricing and availability for the 5SGSED8K2F40C3N Stratix V GS FPGA.

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