5SGSED8K2F40I3

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA

Quantity 981 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8K2F40I3 – Stratix® V GS FPGA, 695,000 logic elements, 1517-BBGA

The 5SGSED8K2F40I3 is a Stratix® V GS Field Programmable Gate Array (FPGA) offering a high-density, DSP-optimized architecture for transceiver‑based, signal‑processing applications. Built on a 28‑nm process with integrated hard IP and transceiver capability, this device targets bandwidth- and DSP‑centric markets such as wireline, military, broadcast, and high‑performance computing.

With approximately 695,000 logic elements, roughly 51.2 Mbits of embedded memory, abundant DSP resources, and 696 I/Os in a 1517‑FBGA package, this industrial‑grade FPGA is specified for -40°C to 100°C operation and a core supply range of 820 mV to 880 mV.

Key Features

  • Core & Process 28‑nm device architecture with enhanced core building blocks and support for embedded hard IP blocks, providing a foundation for high‑performance system designs.
  • Logic Density Approximately 695,000 logic elements to implement complex control, routing, and custom logic functions.
  • Memory Approximately 51.2 Mbits of embedded memory supported by the family’s 20‑Kbit (M20K) memory architecture for data buffering and packet handling.
  • DSP Resources GS‑family devices include variable‑precision DSP blocks supporting up to 3,926 18×18 or 1,963 27×27 multipliers, enabling high‑precision, high‑throughput signal processing.
  • I/O & Transceivers 696 total I/Os in a high‑pin FCBGA package; GS devices provide integrated transceivers with 14.1‑Gbps data‑rate capability for backplane and optical interfaces.
  • Power Core supply voltage specified from 820 mV to 880 mV, enabling predictable power budgeting for system designs.
  • Package & Mounting 1517‑BBGA (1517‑FBGA, 40×40) FCBGA package, surface‑mount mounting for compact, high‑density board implementations.
  • Temperature & Grade Industrial grade with operating temperature range from -40°C to 100°C for demanding environments.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • High‑performance DSP systems — Deploy variable‑precision DSP blocks and abundant multipliers for signal conditioning, filtering, and high‑precision computation.
  • Optical and backplane communications — Use integrated 14.1‑Gbps transceivers and large on‑chip memory for 40G/100G class transport and packet processing.
  • Military and broadcast systems — Industrial operating range and high logic/DSP density support real‑time processing and ruggedized applications.
  • PCIe‑based bandwidth‑centric designs — Leverage embedded hard IP and connectivity options for PCIe Gen implementations and high‑throughput I/O.

Unique Advantages

  • High logic capacity: Approximately 695,000 logic elements enable integration of large custom FPGA fabrics without external logic.
  • Extensive DSP resources: Thousands of dedicated multipliers provide scalable performance for compute‑intensive signal processing tasks.
  • Integrated high‑speed I/O: 696 I/Os and GS‑class transceivers at 14.1 Gbps support demanding interface and bandwidth requirements.
  • Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependence for buffering and packet handling.
  • Industrial‑rated operation: Specified for -40°C to 100°C to meet environmental requirements for deployed systems.
  • Production scalability: Stratix V FPGAs provide a documented path to HardCopy V ASICs for low‑risk migration to higher‑volume production.

Why Choose 5SGSED8K2F40I3?

The 5SGSED8K2F40I3 combines high logic density, abundant DSP multipliers, significant embedded memory, and extensive I/O/transceiver capability in a single industrial‑grade FPG A. It is well suited for designers building transceiver‑based, DSP‑intensive systems that require a compact, high‑performance programmable fabric.

This Stratix® V GS device is positioned for engineers and procurement teams seeking a robust, scalable FPGA platform with clear production migration options and predictable electrical and environmental specifications.

Request a quote or submit a pricing and availability inquiry to start integrating the 5SGSED8K2F40I3 into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up