5SGSED8K2F40I3L

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA

Quantity 875 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8K2F40I3L – Stratix® V GS FPGA, 695,000 logic elements, 1517-FBGA (40×40)

The 5SGSED8K2F40I3L is a Stratix V GS family field programmable gate array (FPGA) from Intel. It delivers high logic capacity and substantial on-chip memory in a 1517-ball FCBGA package for surface-mount applications.

Targeted at industrial designs, this device combines approximately 695,000 logic elements, approximately 51.2 Mbits of embedded memory, and 696 user I/Os to support complex, high-density FPGA implementations that require large I/O and memory resources within a single device.

Key Features

  • Core Capacity  Approximately 695,000 logic elements, enabling dense, complex logic integration on a single device.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, data storage, and memory-intensive logic functions.
  • I/O  Up to 696 user I/Os for broad peripheral connectivity and high pin-count interfacing.
  • Power  Low-voltage core operation specified from 820 mV to 880 mV for the device core supply.
  • Package & Mounting  1517-FBGA (40×40) FCBGA package, surface-mount mounting for compact system designs.
  • Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
  • Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

  • High-density digital signal processing  Large logic capacity and substantial embedded memory make this device suitable for DSP pipelines and algorithm acceleration that require extensive on-chip resources.
  • Industrial control and automation  Industrial temperature rating and broad I/O count support robust control systems, sensor aggregation, and machine-control interfaces.
  • Communications infrastructure  High I/O availability and on-chip RAM allow implementation of complex interface logic, protocol handling, and data buffering within networking equipment.
  • System integration and prototyping  Compact FCBGA packaging with high logic density is well suited for prototype systems and integration where board space and consolidation are priorities.

Unique Advantages

  • High logic density: Integrate large, complex designs on-chip with approximately 695,000 logic elements to reduce board-level component count.
  • Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM for local buffering and state storage, minimizing external memory requirements.
  • Extensive I/O: 696 user I/Os provide flexibility for connecting multiple peripherals, sensors, and high-pin-count interfaces without additional routing complexity.
  • Industrial temperature range: Rated from −40 °C to 100 °C to meet the needs of industrial and other thermally demanding deployments.
  • Low-voltage core operation: Core supply specified between 820 mV and 880 mV, supporting power-optimized system architectures.
  • RoHS compliant & standard package: 1517-FBGA (40×40) FCBGA surface-mount package simplifies assembly and aligns with lead-free manufacturing processes.

Why Choose 5SGSED8K2F40I3L?

The 5SGSED8K2F40I3L delivers a balance of logic capacity, embedded memory, and I/O density in an industrial-grade Stratix V GS FPGA. Its combination of approximately 695k logic elements, ~51.2 Mbits of on-chip RAM, and 696 I/Os makes it well suited for system designs that demand integration of complex functions into a single device while operating across a wide temperature range.

Manufactured by Intel as part of the Stratix V family, this device is appropriate for engineering teams building high-density FPGA solutions for industrial, communications, and system-integration applications where consolidation, memory capacity, and robust thermal performance are key considerations.

Request a quote or submit a purchase inquiry for part number 5SGSED8K2F40I3L to check availability and get pricing information.

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