5SGSED8K2F40I3L
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 875 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSED8K2F40I3L – Stratix® V GS FPGA, 695,000 logic elements, 1517-FBGA (40×40)
The 5SGSED8K2F40I3L is a Stratix V GS family field programmable gate array (FPGA) from Intel. It delivers high logic capacity and substantial on-chip memory in a 1517-ball FCBGA package for surface-mount applications.
Targeted at industrial designs, this device combines approximately 695,000 logic elements, approximately 51.2 Mbits of embedded memory, and 696 user I/Os to support complex, high-density FPGA implementations that require large I/O and memory resources within a single device.
Key Features
- Core Capacity Approximately 695,000 logic elements, enabling dense, complex logic integration on a single device.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, data storage, and memory-intensive logic functions.
- I/O Up to 696 user I/Os for broad peripheral connectivity and high pin-count interfacing.
- Power Low-voltage core operation specified from 820 mV to 880 mV for the device core supply.
- Package & Mounting 1517-FBGA (40×40) FCBGA package, surface-mount mounting for compact system designs.
- Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
- Compliance RoHS compliant, supporting regulatory requirements for lead-free assemblies.
Typical Applications
- High-density digital signal processing Large logic capacity and substantial embedded memory make this device suitable for DSP pipelines and algorithm acceleration that require extensive on-chip resources.
- Industrial control and automation Industrial temperature rating and broad I/O count support robust control systems, sensor aggregation, and machine-control interfaces.
- Communications infrastructure High I/O availability and on-chip RAM allow implementation of complex interface logic, protocol handling, and data buffering within networking equipment.
- System integration and prototyping Compact FCBGA packaging with high logic density is well suited for prototype systems and integration where board space and consolidation are priorities.
Unique Advantages
- High logic density: Integrate large, complex designs on-chip with approximately 695,000 logic elements to reduce board-level component count.
- Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM for local buffering and state storage, minimizing external memory requirements.
- Extensive I/O: 696 user I/Os provide flexibility for connecting multiple peripherals, sensors, and high-pin-count interfaces without additional routing complexity.
- Industrial temperature range: Rated from −40 °C to 100 °C to meet the needs of industrial and other thermally demanding deployments.
- Low-voltage core operation: Core supply specified between 820 mV and 880 mV, supporting power-optimized system architectures.
- RoHS compliant & standard package: 1517-FBGA (40×40) FCBGA surface-mount package simplifies assembly and aligns with lead-free manufacturing processes.
Why Choose 5SGSED8K2F40I3L?
The 5SGSED8K2F40I3L delivers a balance of logic capacity, embedded memory, and I/O density in an industrial-grade Stratix V GS FPGA. Its combination of approximately 695k logic elements, ~51.2 Mbits of on-chip RAM, and 696 I/Os makes it well suited for system designs that demand integration of complex functions into a single device while operating across a wide temperature range.
Manufactured by Intel as part of the Stratix V family, this device is appropriate for engineering teams building high-density FPGA solutions for industrial, communications, and system-integration applications where consolidation, memory capacity, and robust thermal performance are key considerations.
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