5SGSED8K2F40I3N

The 5SGSED8K2F40I3N is a Stratix V GS FPGA from Intel, provided in a high-density 1517-BBGA FCBGA package for surface-mount assembly. This device combines a very large logic capacity with substantial embedded RAM and a high I/O count, making it suitable for complex digital designs that require significant on-chip resources and connectivity.

Specified for industrial temperature operation and a low-voltage core supply, the device is appropriate for designs that demand robust thermal range and power-sensitive core operation. It is part of the Stratix V device family and follows the family’s published electrical and switching characteristics.

Key Features

• Logic Capacity  Approximately 695,000 logic elements, enabling large-scale custom logic implementations and complex datapath architectures.
• Embedded Memory  Approximately 51.2 Mbits of total on-chip RAM, supporting deep buffering, large lookup tables, and internal data storage.
• I/O Density  696 user I/O pins to support wide parallel interfaces and multiple external peripherals or high-speed front-end connectivity.
• Core Voltage  Core supply range of 820 mV to 880 mV, allowing designers to target the device’s specified power domain and performance points.
• Package & Mounting  1517-BBGA (FCBGA) surface-mount package; supplier device package listed as 1517-FBGA (40×40), suitable for high-density board layouts.
• Operating Grade & Temperature  Industrial grade with an operating temperature range of −40 °C to 100 °C for extended-environment deployment.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-density compute acceleration  Use the large logic resource and embedded memory to implement custom compute pipelines and hardware accelerators.
• Networking and data plane processing  High I/O count and ample on-chip RAM make the device suitable for packet buffering, header processing, and interface aggregation.
• Instrumentation and test systems  Industrial temperature rating and extensive logic resources support real-time signal processing and custom measurement logic.

Unique Advantages

• Substantial on-chip resources:  Nearly 695k logic elements and ~51.2 Mbits of embedded RAM reduce dependence on external components and simplify board-level BOM.
• High I/O capacity:  696 I/Os provide broad connectivity options for parallel interfaces, front-end devices, and multi-channel designs.
• Industrial temperature support:  Rated from −40 °C to 100 °C for deployment in extended-environment applications.
• Compact, high-density package:  1517-BBGA FCBGA packaging enables dense PCB integration while supporting the device’s pin count and power requirements.
• Low-voltage core operation:  820 mV to 880 mV core supply range for designs targeting efficient core power domains.
• RoHS compliant:  Meets RoHS requirements for environmental and regulatory considerations.

Why Choose 5SGSED8K2F40I3N?

The 5SGSED8K2F40I3N positions itself where large-scale programmable logic, significant embedded memory, and extensive I/O are required in a single device. Its industrial temperature rating and compact FCBGA package make it appropriate for demanding applications that need both performance and environmental robustness.

Engineers designing complex datapath processing, network infrastructure, or instrumentation platforms will find the device’s resource mix—logic elements, on-chip RAM, and high I/O count—well suited to reducing external component count and enabling tightly integrated system designs. As part of the Stratix V family, the device follows the documented electrical and switching characteristics for that product family.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGSED8K2F40I3N and to discuss how it fits your next design.