5SGSED8K3F40C2LN

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA

Quantity 457 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8K3F40C2LN – Stratix® V GS FPGA, 695,000 logic elements, 1517-BBGA

The 5SGSED8K3F40C2LN is an Intel Stratix® V GS field-programmable gate array (FPGA) designed for DSP-centric, transceiver-enabled designs. Built on a 28-nm process, this GS-variant device combines high logic density with abundant DSP resources and embedded memory to address data-intensive and high-performance signal processing applications.

Key value comes from its high logic capacity, large on-chip memory, extensive I/O, and a package suitable for surface-mount assembly, making it suitable for designs that require scalable compute, integrated transceivers, and a clear prototyping path to production ASICs.

Key Features

  • Logic Capacity — 695,000 logic elements for implementing large, complex designs and high-density logic functions.
  • Embedded Memory — Approximately 51.2 Mbits of on-chip RAM (51,200,000 bits) to support frame buffering, parameter storage, and intermediate data processing.
  • DSP Resources — GS-family architecture provides abundant variable-precision DSP blocks; family guidance includes support for up to 3,926 18×18 or 1,963 27×27 multipliers for high-performance signal processing.
  • Transceiver and I/O Capability — Up to 696 I/O pins and GS-class integrated transceivers with up to 14.1 Gbps capability per family documentation, enabling high-speed serial interfaces and backplane/optical links.
  • Process and Hard IP — 28-nm TSMC technology with Embedded HardCopy Block capability for hardened IP instantiation, including PCIe Gen3/Gen2/Gen1 hardening options noted in the Stratix V family documentation.
  • Power — Core supply range specified at 0.820–0.880 V to match platform power-rail design requirements.
  • Package and Mounting — 1517-BBGA (FCBGA) supplier device package 1517-FBGA (40×40); surface-mount mounting for board-level integration.
  • Commercial Grade — Operating temperature range 0 °C to 85 °C, RoHS-compliant.

Typical Applications

  • High-performance DSP systems — Implement filtering, channelization, and complex math using the device’s variable-precision DSP blocks and large embedded memory.
  • Network and optical transport — Leverage GS-family transceiver capability and high I/O count for backplane and optical interface applications in packet processing and transport equipment.
  • Data-center and compute acceleration — Use the high logic capacity and on-chip RAM to accelerate data-path and network functions in compute and storage systems.
  • Prototyping for ASIC migration — Prototype production designs on Stratix V GS devices and use the documented path to HardCopy V ASICs for higher-volume deployments.

Unique Advantages

  • High logic density: 695,000 logic elements enable large, integration-heavy designs while reducing the need for external logic.
  • Significant embedded memory: Approximately 51.2 Mbits of on-chip RAM supports buffering and state storage close to compute resources for lower latency.
  • DSP-optimized architecture: GS-family variable-precision DSP blocks provide the arithmetic throughput required for demanding signal-processing pipelines.
  • Extensive I/O and transceiver support: Up to 696 I/Os and GS-class transceivers enable high-bandwidth interfaces for networking and communications systems.
  • Production scalability: Family-level support for Embedded HardCopy Blocks and HardCopy V ASIC path helps reduce risk when moving from prototype to volume production.
  • Commercial-ready packaging: 1517-BBGA surface-mount package suitable for standard assembly processes and compact board designs.

Why Choose 5SGSED8K3F40C2LN?

The 5SGSED8K3F40C2LN positions itself as a high-density, DSP-focused Stratix V GS FPGA that balances logic capacity, on-chip memory, and high-speed I/O to support data-intensive and transceiver-based applications. Its combination of nearly 695k logic elements, large embedded RAM, and family-level DSP/transceiver capabilities makes it well suited for developers building advanced networking, broadcast, and high-performance compute systems.

For teams planning product roadmaps, the Stratix V family’s documented path to HardCopy V ASICs and the robust architecture foundations provide a clear route from prototype to production while maintaining compatibility with high-bandwidth interface requirements and commercial-temperature operation.

Request a quote or submit an inquiry to receive pricing, availability, and configuration support for the 5SGSED8K3F40C2LN.

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