5SGSED8K3F40C4G

The 5SGSED8K3F40C4G is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel. This commercial-grade device provides 695,000 logic elements, approximately 51.2 Mbits of embedded memory, and up to 696 I/O connections in a 1517-BBGA FCBGA package.

Engineered for commercial systems requiring large logic capacity and dense external interfacing, the 5SGSED8K3F40C4G combines substantial on-chip RAM and high I/O count with a surface-mount 1517-FBGA (40×40) package and a low-voltage core supply range.

Key Features

• Core Capacity  695,000 logic elements suitable for large-scale logic integration and complex designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support data buffering and local storage needs.
• I/O Resources  696 I/O pins to enable dense external interfacing and multi-port connectivity.
• Package and Mounting  1517-BBGA (FCBGA) package; supplier device package 1517-FBGA (40×40); surface mount mounting type.
• Power  Core voltage supply range from 820 mV to 880 mV.
• Temperature Range  Commercial operating range: 0 °C to 85 °C.
• Compliance  RoHS compliant.
• Stratix V GS Family  Part of the Stratix V GS family; Stratix V GS devices are offered in -1, -2, and -3 transceiver speed grades according to device documentation.

Typical Applications

• High-density signal processing  Leverage the large logic capacity and embedded memory for complex data-path and DSP implementations.
• I/O-intensive system controllers  Use the high pin-count to support boards and modules requiring numerous external interfaces and peripherals.
• Commercial networking and communications equipment  Deploy in commercial-grade systems where integrated logic, memory, and I/O density are required.

Unique Advantages

• High logic integration: 695,000 logic elements allow consolidation of multiple functions and large designs onto a single device, reducing inter-chip connectivity.
• Substantial on-chip RAM: Approximately 51.2 Mbits of embedded memory lowers dependence on external memory and simplifies board design.
• Extensive I/O capacity: 696 I/Os facilitate complex interfacing and support multi-channel systems without excessive multiplexing.
• Compact surface-mount packaging: 1517-BBGA (1517-FBGA 40×40) provides a compact form factor for space-constrained commercial assemblies.
• Commercial temperature rating: 0 °C to 85 °C suits a wide range of standard commercial deployments.
• Regulatory readiness: RoHS compliance supports environmental and regulatory requirements for commercial products.

Why Choose 5SGSED8K3F40C4G?

The 5SGSED8K3F40C4G offers a combination of large logic capacity, significant on-chip RAM, and a very high I/O count in a compact FCBGA package, making it well suited for complex commercial systems that require integrated digital functions and dense external interfacing. Its commercial temperature rating and RoHS compliance align it with standard commercial deployment requirements.

Designers who need to consolidate multiple subsystems, reduce board-level memory requirements, and maintain a high pin count will find the 5SGSED8K3F40C4G a compelling option for scalable, high-density FPGA implementations.

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