5SGSED8K3F40I3G

The 5SGSED8K3F40I3G is a Stratix® V GS field-programmable gate array (FPGA) offered in an industrial-grade package. It combines a high logic capacity with a large on-chip RAM footprint and a substantial I/O count to support complex digital designs and system integration.

Designed for applications that require dense logic, substantial embedded memory, and extensive I/O, this device delivers integration and flexibility while operating across an industrial temperature range and a low core-voltage domain.

Key Features

• Logic Capacity  695,000 logic elements (cells) to implement large-scale digital designs and complex algorithms on a single device.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM (51,200,000 total RAM bits) for buffering, packet storage, and large data structures without external memory.
• I/O Density  696 user I/Os for broad peripheral connectivity, multi-channel interfaces, and high-pin-count system designs.
• Power Domain  Core voltage supply range of 820 mV to 880 mV, enabling compatibility with low-voltage power architectures.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), designed for surface-mount assembly.
• Industrial Grade & Temperature  Industrial temperature grade with an operating range of −40 °C to 100 °C for robust deployment in demanding environments.
• Regulatory  RoHS compliant.
• Family Documentation  Part of the Stratix V family; electrical and switching characteristics for Stratix V devices are documented in the device datasheet.

Typical Applications

• Network & Telecom Infrastructure  High logic density and large on-chip RAM enable packet processing, protocol offload, and multi-port switching functions.
• Signal Processing & Acceleration  Substantial logic resources and embedded memory support DSP blocks, filters, and hardware acceleration pipelines.
• High‑I/O Systems  Offers abundant I/O for multi-channel data acquisition, instrumentation front-ends, and multi-protocol bridging.
• Industrial Control & Automation  Industrial temperature rating and robust packaging suit machinery control, real-time processing, and factory automation modules.

Unique Advantages

• High integration density: Consolidate complex functions on-chip with 695,000 logic elements and reduce external components.
• Large embedded memory footprint: Approximately 51.2 Mbits of on-chip RAM reduces dependence on external DRAM for many buffering and stateful tasks.
• Extensive connectivity: 696 I/Os provide flexibility to interface with multiple peripherals, sensors, and high-speed front-end devices.
• Industrial readiness: Rated for −40 °C to 100 °C operation, enabling deployments in thermally challenging environments.
• Low-voltage core operation: Core supply between 820 mV and 880 mV supports modern low-power power-rail architectures.
• Surface-mount, high-pin-count package: 1517-BBGA (40×40) package supports dense board-level integration and reliable solder assembly.

Why Choose 5SGSED8K3F40I3G?

The 5SGSED8K3F40I3G positions itself as a high-capacity, industrial-grade Stratix V GS FPGA for designs that require a combination of large logic resources, significant embedded memory, and expansive I/O. Its specified operating temperature range and RoHS compliance make it suitable for long-term deployment in industrial systems.

Engineers and system designers seeking a single-device solution for complex packet processing, DSP acceleration, or dense I/O aggregation will find the device’s resource mix and package options conducive to streamlined board design and integration.

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