5SGSED8K3F40I3LG

The 5SGSED8K3F40I3LG is a Stratix® V GS field programmable gate array (FPGA) offered in an industrial temperature grade. It delivers a large logic fabric and substantial on-chip memory together with a high I/O count for dense, I/O‑intensive designs.

With a core supply voltage range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C, this surface‑mount FCBGA device targets applications that require significant logic capacity, embedded memory, and wide temperature operation.

Key Features

• Logic Capacity  695,000 logic elements (cells) for implementing complex, large-scale logic designs.
• Embedded Memory  Approximately 51.2 Mbits of embedded memory (51,200,000 bits) to support on-chip buffering, packet storage, or large state machines.
• I/O Density  696 I/Os to accommodate high pin-count interfaces and dense external connectivity.
• Power/Voltage  Core voltage supply specified from 820 mV to 880 mV for defined power domain planning.
• Package & Mounting  1517‑BBGA (FCBGA) package; supplier device package listed as 1517‑FBGA (40×40). Surface mountable for standard PCB assembly.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial environment deployment.
• Standards Compliance  RoHS compliant.

Typical Applications

• High‑density logic implementations  Leverage 695,000 logic elements and extensive embedded memory for complex FPGA designs that require considerable on‑chip resources.
• High‑I/O systems  Use the 696 I/Os to interface with multiple external devices, sensors, or parallel bus architectures without external I/O expanders.
• Industrial and ruggedized equipment  Industrial temperature grading (−40 °C to 100 °C) supports deployment in equipment operating across wide temperature ranges.

Unique Advantages

• Large programmable fabric: 695,000 logic elements allow integration of sizeable logic functions on a single device, reducing external components.
• Substantial on‑chip memory: Approximately 51.2 Mbits of embedded memory supports data buffering and stateful implementations without immediate external memory.
• High I/O count: 696 I/Os enable direct connection to many peripherals and interfaces, simplifying board-level routing and system architecture.
• Industrial temperature rating: −40 °C to 100 °C rating provides design confidence for industrial environments.
• FCBGA surface-mount package: 1517‑BBGA packaging in a 1517‑FBGA (40×40) footprint supports compact, board‑level integration.
• Regulatory compliance: RoHS compliant to support environmental regulatory requirements.

Why Choose 5SGSED8K3F40I3LG?

The 5SGSED8K3F40I3LG combines very large logic capacity, significant embedded memory, and a high I/O count in an industrial‑rated FCBGA package. Its specified core voltage range and wide operating temperature make it suitable for designers who need predictable electrical and thermal operating points while integrating dense logic and I/O on a single FPGA.

This device is appropriate for engineering teams building complex, I/O‑heavy, and memory‑intensive FPGA systems that require industrial temperature performance and RoHS compliance. Its package and electrical specifications support integration into standard surface‑mount PCB workflows.

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