5SGSED8K3F40I4G

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA

Quantity 1,222 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8K3F40I4G – Stratix® V GS FPGA, 695,000 logic elements, 696 I/Os

The 5SGSED8K3F40I4G is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial temperature grade. It delivers high logic capacity and extensive I/O in a high-density FCBGA package, enabling complex digital designs that require substantial on-chip resources and a wide operating temperature range.

Key technical attributes include 695,000 logic elements, approximately 51.2 Mbits of embedded memory, 696 user I/Os, and a recommended core voltage supply between 820 mV and 880 mV—making it suited for demanding industrial applications that require large fabric capacity and robust environmental performance.

Key Features

  • High Logic Capacity — 695,000 logic elements for implementing complex, large-scale digital functions and deep custom logic.
  • Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support data buffering, state storage, and memory-intensive processing without immediate external memory dependency.
  • Extensive I/O — 696 I/O pins to support broad interfacing options for peripherals, parallel buses, and external devices.
  • Power and Core Voltage — Core voltage supply specified from 820 mV to 880 mV to match system power-architecture requirements.
  • Industrial Grade Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Package and Mounting — 1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) designed for surface-mount assembly in compact board layouts.
  • RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing.

Typical Applications

  • High-density digital systems — Architectures that require hundreds of thousands of logic elements and substantial on-chip RAM for complex processing.
  • Industrial control and automation — Systems that benefit from wide operating temperatures and an industrial-grade FPGA footprint.
  • Data aggregation and I/O-rich designs — Applications needing large numbers of user I/Os for interfacing with multiple peripherals, sensors, or parallel data streams.

Unique Advantages

  • Large programmable fabric: 695,000 logic elements provide a platform for scaling functionality without immediate hardware changes.
  • Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory for many buffering and processing tasks.
  • Wide I/O complement: 696 I/O pins enable flexible system interfacing and dense peripheral connectivity.
  • Industrial thermal capability: Specified −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
  • Compact, surface-mount package: 1517-BBGA (40×40) FCBGA package offers high integration density for space-constrained boards.
  • Aligned with industry requirements: RoHS compliance ensures suitability for modern manufacturing processes and regulations.

Why Choose 5SGSED8K3F40I4G?

The 5SGSED8K3F40I4G positions itself as a high-capacity Stratix V GS FPGA tailored for industrial applications that demand significant programmable logic, abundant embedded memory, and a large I/O count. Its specified operating range and FCBGA packaging make it a practical choice for engineers designing robust, high-density digital systems.

For teams needing scalability and integration in complex designs, this device offers a combination of logic resources, memory, and I/O that supports advanced custom hardware implementations while aligning with industrial temperature and manufacturing requirements.

If you would like pricing, availability, or to request a formal quote for the 5SGSED8K3F40I4G, submit an inquiry to receive detailed commercial information and ordering options.

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