5SGSED8K3F40I4G
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,222 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSED8K3F40I4G – Stratix® V GS FPGA, 695,000 logic elements, 696 I/Os
The 5SGSED8K3F40I4G is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial temperature grade. It delivers high logic capacity and extensive I/O in a high-density FCBGA package, enabling complex digital designs that require substantial on-chip resources and a wide operating temperature range.
Key technical attributes include 695,000 logic elements, approximately 51.2 Mbits of embedded memory, 696 user I/Os, and a recommended core voltage supply between 820 mV and 880 mV—making it suited for demanding industrial applications that require large fabric capacity and robust environmental performance.
Key Features
- High Logic Capacity — 695,000 logic elements for implementing complex, large-scale digital functions and deep custom logic.
- Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support data buffering, state storage, and memory-intensive processing without immediate external memory dependency.
- Extensive I/O — 696 I/O pins to support broad interfacing options for peripherals, parallel buses, and external devices.
- Power and Core Voltage — Core voltage supply specified from 820 mV to 880 mV to match system power-architecture requirements.
- Industrial Grade Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Package and Mounting — 1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) designed for surface-mount assembly in compact board layouts.
- RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing.
Typical Applications
- High-density digital systems — Architectures that require hundreds of thousands of logic elements and substantial on-chip RAM for complex processing.
- Industrial control and automation — Systems that benefit from wide operating temperatures and an industrial-grade FPGA footprint.
- Data aggregation and I/O-rich designs — Applications needing large numbers of user I/Os for interfacing with multiple peripherals, sensors, or parallel data streams.
Unique Advantages
- Large programmable fabric: 695,000 logic elements provide a platform for scaling functionality without immediate hardware changes.
- Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory for many buffering and processing tasks.
- Wide I/O complement: 696 I/O pins enable flexible system interfacing and dense peripheral connectivity.
- Industrial thermal capability: Specified −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
- Compact, surface-mount package: 1517-BBGA (40×40) FCBGA package offers high integration density for space-constrained boards.
- Aligned with industry requirements: RoHS compliance ensures suitability for modern manufacturing processes and regulations.
Why Choose 5SGSED8K3F40I4G?
The 5SGSED8K3F40I4G positions itself as a high-capacity Stratix V GS FPGA tailored for industrial applications that demand significant programmable logic, abundant embedded memory, and a large I/O count. Its specified operating range and FCBGA packaging make it a practical choice for engineers designing robust, high-density digital systems.
For teams needing scalability and integration in complex designs, this device offers a combination of logic resources, memory, and I/O that supports advanced custom hardware implementations while aligning with industrial temperature and manufacturing requirements.
If you would like pricing, availability, or to request a formal quote for the 5SGSED8K3F40I4G, submit an inquiry to receive detailed commercial information and ordering options.

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