5SGSED8N1F45C2LG

The 5SGSED8N1F45C2LG is a Stratix V GS family FPGA from Intel, delivering a high-density programmable logic solution for complex digital designs. This device integrates 695,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 I/Os to support designs that require large on‑chip memory and extensive connectivity.

Targeted for commercial‑grade applications, the device operates from a 0.820 V to 0.880 V core supply and an ambient range of 0 °C to 85 °C, and is supplied in a 1932‑BBGA (FCBGA) package for surface‑mount assembly.

Key Features

• Core Logic  695,000 logic elements to implement large, complex logic designs and custom hardware acceleration.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM for buffers, FIFOs, and large state machines.
• I/O Density  840 I/O pins to support high‑connectivity systems and multi‑channel interfaces.
• Power Supply  Core voltage specified at 820 mV to 880 mV for the device core domain.
• Package & Mounting  1932‑BBGA (FCBGA) supplier device package: 1932‑FBGA, FC (45×45); surface mount package optimized for high pin‑count board designs.
• Temperature & Grade  Commercial grade operation across 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant, meeting standard lead‑free environmental requirements.

Typical Applications

• High‑density Logic Integration  Implement complex state machines, datapaths, and custom accelerators using the device’s large logic element count and on‑chip memory.
• High‑I/O Systems  Systems requiring extensive external connectivity can leverage the 840 I/Os for multi‑lane interfaces and peripheral aggregation.
• Data Buffering and Packet Processing  The approximately 51.2 Mbits of embedded RAM supports large buffering and packet/frame handling in data‑intensive designs.
• Platform Prototyping  Use the device in commercial‑grade prototypes where high logic density and memory capacity enable system‑level validation.

Unique Advantages

• High Logic Density: 695,000 logic elements provide room for complex, multi‑function designs without external glue logic.
• Substantial On‑Chip Memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory and simplifies board design.
• Extensive I/O Count: 840 I/Os enable broad connectivity options and support for multi‑channel interfaces directly from the FPGA.
• Compact High‑Pin Package: 1932‑BBGA (FCBGA) package consolidates high pin count in a 45×45 supplier footprint for dense PCB layouts.
• Commercial‑Grade Operation: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronic products.
• RoHS Compliant: Meets environmental requirements for lead‑free assembly and standard compliance.

Why Choose 5SGSED8N1F45C2LG?

The 5SGSED8N1F45C2LG combines large logic capacity, sizable embedded memory, and a very high I/O count in a single commercial‑grade Stratix V GS FPGA package. This balance of resources makes it well suited for engineers designing complex digital systems that require on‑chip memory, dense logic, and broad external connectivity.

Backed by Intel’s Stratix V device documentation and datasheet information, this device is appropriate for teams needing a scalable, high‑density FPGA platform with verified electrical and package specifications for commercial applications.

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