5SGSED8N1F45C2L

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 1,026 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8N1F45C2L – Stratix® V GS FPGA, 695,000 Logic Elements, 1932‑BBGA

The 5SGSED8N1F45C2L is a Stratix V GS field‑programmable gate array (FPGA) in a 1932‑BBGA FCBGA package. Built on a 28‑nm process, this GS variant integrates a large array of variable‑precision DSP resources and high‑speed transceiver capability targeted at transceiver‑based, DSP‑centric systems.

With approximately 695,000 logic elements, roughly 51.2 Mbits of embedded memory, and up to 840 I/Os, this device is positioned for high‑performance signal processing, network and communications equipment, broadcast, and high‑performance computing applications where on‑chip DSP and transceiver integration reduce board complexity and improve system throughput.

Key Features

  • Logic Capacity  Approximately 695,000 logic elements for building large, complex digital systems.
  • Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM implemented with 20 Kbit (M20K) embedded memory blocks for buffering, FIFOs, and data staging.
  • DSP Resources  Abundant variable‑precision DSP blocks supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high‑throughput, precision signal processing.
  • Transceiver Integration  Integrated transceivers with 14.1‑Gbps data‑rate capability (Stratix V GS family), suitable for backplane and optical interface applications.
  • Core Architecture  Adaptive Logic Modules (ALMs), multi‑track routing architecture, and comprehensive fabric clocking for system‑level performance and timing flexibility.
  • Hard IP and ASIC Path  Embedded HardCopy Block available in the Stratix V family to support hardened IP instantiation (example: PCIe Gen3/Gen2/Gen1) and a low‑risk migration path to HardCopy ASICs.
  • Clocking and PLLs  Fractional phase‑locked loops (PLLs) for flexible clock management across fabric and transceivers.
  • Package and I/O  1932‑BBGA (45×45 mm) FCBGA package with up to 840 I/O pins; surface‑mount mounting type suitable for dense system assemblies.
  • Power and Thermal  Core voltage supply range of 820 mV to 880 mV; commercial operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • High‑Performance DSP Systems  Deploy variable‑precision DSP blocks and large on‑chip memory for real‑time signal processing, filtering, and transform engines.
  • Optical and Backplane Interfaces  Use integrated 14.1‑Gbps transceivers for backplane and optical data transport in networking and communication equipment.
  • Broadcast and Video Processing  Leverage extensive DSP multipliers and memory for video encoding/decoding, format conversion, and real‑time processing tasks.
  • High‑Performance Computing and Test Equipment  Combine high logic density and DSP resources for acceleration, prototyping, and system test applications.

Unique Advantages

  • High DSP Density:  Thousands of DSP multipliers enable complex, high‑precision signal processing workloads without extensive external ASICs.
  • Integrated High‑Speed I/O:  On‑chip transceivers reduce board‑level SERDES components and simplify high‑bandwidth interface designs.
  • Substantial On‑Chip Memory:  Approximately 51.2 Mbits of embedded RAM supports large buffers and on‑device data handling to lower external memory requirements.
  • Robust Core Architecture:  ALMs, multi‑track routing, and fractional PLLs provide flexible timing and routing options for complex designs.
  • Production Scalability:  Embedded HardCopy Block capability and family migration options support prototyping to volume ASIC flow within the Stratix V ecosystem.
  • Commercial‑Grade Reliability:  Operates across a 0 °C to 85 °C range with RoHS compliance for standard commercial deployments.

Why Choose 5SGSED8N1F45C2L?

The 5SGSED8N1F45C2L combines substantial logic capacity, a large pool of embedded memory, and extensive DSP and transceiver resources in a dense 1932‑BBGA package. Its architecture and on‑chip building blocks are tuned for transceiver‑based, DSP‑centric designs where integration of high‑speed I/O and compute resources reduces board complexity and accelerates time to market.

This device is suited for engineering teams developing networking, broadcast, test and measurement, or high‑performance compute systems that require on‑device signal processing, high I/O counts, and a clear upgrade path within the Stratix V family. The combination of core architecture features and production migration options delivers a practical balance of performance, integration, and long‑term design scalability.

Request a quote or submit a request for pricing and availability for the 5SGSED8N1F45C2L to begin integrating this Stratix V GS FPGA into your next high‑performance design.

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