5SGSED8N1F45C2LN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 30 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8N1F45C2LN – Stratix® V GS FPGA, 695,000 Logic Elements, 1932-BBGA

The 5SGSED8N1F45C2LN is an Intel Stratix V GS field-programmable gate array (FPGA) offered in a 1932‑BBGA FCBGA package. This device combines large logic capacity, abundant embedded memory, and GS-class DSP/transceiver resources to address transceiver-based, DSP-centric, and data‑intensive applications.

Designed for commercial-temperature systems, the device targets high-throughput and signal-processing use cases where a high I/O count, substantial on-chip RAM, and configurable DSP resources are required.

Key Features

  • Logic Capacity  Approximately 695,000 logic elements for complex programmable logic and system integration.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM, implemented with M20K embedded memory blocks for large buffering and data storage.
  • Variable-Precision DSP Blocks  GS-class variable-precision DSP resources supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high-precision signal processing.
  • Integrated Transceivers  Integrated transceivers with 14.1 Gbps data-rate capability for backplane and optical-interface links (GS variant capability).
  • I/O and Packaging  840 general-purpose I/O pins in a 1932‑BBGA package; supplier package listed as 1932‑FBGA, FC (45 × 45). Surface-mount mounting type.
  • Power and Voltage  Core supply range of 0.82 V to 0.88 V to match system power budgets.
  • Temperature Grade  Commercial operating range from 0 °C to 85 °C.
  • Fabric and Clocking  Redesigned adaptive logic modules (ALMs), multi-track routing fabric, and fractional PLLs for flexible clocking and routing (family-level architecture).
  • Embedded Hard IP  Embedded HardCopy block to support hardened IP instantiation such as PCIe Gen3/Gen2/Gen1.
  • Compliance  RoHS compliant.

Typical Applications

  • High‑performance DSP systems  Leverage the device’s large DSP multiplier count and extensive on-chip RAM for real-time signal processing and algorithm acceleration.
  • Optical and backplane communications  Use integrated 14.1 Gbps transceivers for high-speed links in optical transport and backplane interfaces.
  • 40G/100G networking  Deploy logic capacity and embedded memory to implement packet processing, traffic management, and protocol acceleration for data‑intensive networking systems.
  • Broadcast and military communications  Apply high-precision DSP and transceiver capabilities for modulation, filtering, and high‑bandwidth signaling tasks in broadcast and defense applications.

Unique Advantages

  • Large programmable fabric: 695,000 logic elements enable integration of complex custom logic, state machines, and accelerators within a single device.
  • Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces the need for external buffering and simplifies memory architecture.
  • Rich DSP resources: Up to 3,926 18×18 or 1,963 27×27 multipliers provide flexible numeric precision for demanding signal-processing algorithms.
  • High I/O density: 840 I/O pins support dense peripheral interfaces and multi-lane high-speed connectivity without external expansion.
  • Configurable transceiver bandwidth: Integrated transceivers (14.1 Gbps capability) offer direct support for high-speed serial links and system-level connectivity.
  • Commercial temperature readiness: Rated for 0 °C to 85 °C operation for deployment in standard commercial systems.

Why Choose 5SGSED8N1F45C2LN?

The 5SGSED8N1F45C2LN combines a large logic footprint, significant on-chip RAM, dense I/O, and GS-class DSP/transceiver resources to deliver a highly capable platform for transceiver-based, DSP-centric, and data-intensive designs. Its Stratix V family architecture—featuring ALMs, M20K memory blocks, fractional PLLs, and embedded HardCopy support—provides a measured balance of integration and configurability for system designers.

This device is suited for teams building complex FPGA-based subsystems in networking, communications, broadcast, and high-performance computing domains where programmable logic, embedded memory, and high-speed serial connectivity must coexist within a commercial-temperature product.

Request a quote or submit an RFQ for the 5SGSED8N1F45C2LN to discuss availability, pricing, and lead times.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up