5SGSED8N1F45C2G

The 5SGSED8N1F45C2G is a Stratix V GS family Field Programmable Gate Array (FPGA) device offering very high logic capacity and I/O density in a surface-mount BGA package. It provides approximately 695,000 logic elements and approximately 51.2 Mbits of embedded memory, making it suitable for designs that require substantial on-chip programmable logic and memory resources.

Designed as a commercial-grade device, this FPGA supports a wide GPIO count and tight core supply voltage range, and is RoHS compliant. The device is supplied in a 1932-ball FCBGA package (45 × 45 mm outline) and is intended for applications requiring dense integration and high I/O connectivity within the specified commercial temperature range.

Key Features

• Large Logic Capacity — Approximately 695,000 logic elements to implement complex digital designs and high-density programmable logic.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for data buffering, state storage, and memory-intensive functions.
• High I/O Count — 840 user I/O pins to support wide parallel interfaces and large connector requirements.
• Package and Mounting — Surface-mount 1932-BBGA (also referenced as 1932-FBGA, FC 45×45 mm) delivering high pin-count in a compact ball-grid array.
• Power and Voltage — Core supply range specified from 870 mV to 930 mV for integration with precision power rails.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial-environment deployments.
• Regulatory — RoHS compliant.

Typical Applications

• High‑density FPGA designs — Implement large-scale logic, complex state machines, and custom accelerators using the device’s substantial logic and memory resources.
• High‑I/O systems — Support wide parallel interfaces, multi-lane connectors, or board-level I/O expansion with 840 available I/Os.
• On‑chip buffering and data handling — Use the approximately 51.2 Mbits of embedded RAM for packet buffering, frame storage, or intermediate data processing.

Unique Advantages

• High integration density: Large logic element count and significant embedded memory reduce the need for external components and simplify system partitioning.
• Extensive I/O capability: 840 I/Os enable complex board-level interfacing and flexible pin assignment for large connectivity requirements.
• Compact, high‑pin package: 1932-ball FCBGA (45×45 mm) provides very high pin count within a standard BGA footprint for dense PCB designs.
• Commercial temperature and RoHS compliance: Designed for standard commercial environments while meeting RoHS environmental requirements.
• Controlled core supply range: Defined 870 mV–930 mV core voltage specification supports precise power-supply planning and margining.

Why Choose 5SGSED8N1F45C2G?

The 5SGSED8N1F45C2G positions itself as a high-capacity Stratix V GS FPGA for commercial applications that need extensive programmable logic, on-chip memory, and very high I/O counts in a compact ball-grid package. Its combination of approximately 695,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 840 I/Os makes it suitable for designs that demand large internal resources and dense connectivity.

For engineering teams targeting scalable, high-density programmable solutions, this device delivers measurable on-chip resources and well-defined electrical and mechanical specifications for straightforward system integration and supply-chain planning.

Request a quote or submit a procurement inquiry to get pricing and availability for the 5SGSED8N1F45C2G.