5SGSED8N1F45I2G

The 5SGSED8N1F45I2G is an Intel Stratix V GS family FPGA supplied in a 1932-ball FCBGA package for surface-mount assembly. It delivers high-density programmable logic with a substantial on-chip memory complement and a large I/O count for complex, high-pin-count designs.

Key device attributes include 695,000 logic elements, approximately 51.2 Mbits of embedded memory, 840 available I/Os, an industrial operating temperature range of −40 °C to 100 °C, and a core supply range of 870 mV to 930 mV. The device is RoHS compliant.

Key Features

• Logic Capacity  695,000 logic elements provide a high-density programmable fabric for complex logic, custom accelerators, and large finite-state machines.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM supports buffering, lookup tables, and data-path storage without external memory for many use cases.
• I/O Resources  840 I/Os accommodate wide parallel interfaces, multi-channel connectivity, and high-pin-count board designs.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Low-Voltage Core  Core supply specified from 870 mV to 930 mV for designs targeting low-voltage FPGA operation.
• Package and Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45 × 45). Surface-mount mounting type for standard PCB assembly processes.
• Standards and Compliance  RoHS compliant, aligning with lead-free and hazardous-substance requirements.

Unique Advantages

• High integration density: 695,000 logic elements with ~51.2 Mbits of embedded memory reduce reliance on external logic and RAM, simplifying BOM and board routing.
• Large I/O capacity: 840 I/Os enable extensive external interfacing without I/O expanders, facilitating parallel data paths and multi-channel systems.
• Industrial robustness: Rated for −40 °C to 100 °C operation, making the device suitable for temperature-challenging installations.
• Compact, high-pin package: 1932-ball FCBGA (45 × 45) provides a dense pinout for complex interconnects in a compact footprint.
• Predictable power envelope: Documented core supply range (870 mV–930 mV) supports deterministic power budgeting and thermal design.
• Regulatory alignment: RoHS compliance supports deployment in regions and products that require hazardous-substance controls.

Why Choose 5SGSED8N1F45I2G?

The 5SGSED8N1F45I2G positions itself as a high-capacity Stratix V GS FPGA option for designs demanding dense logic, significant on-chip memory, and extensive I/O in an industrial-rated device. Its combination of logic resources, embedded RAM, and a 1932-BBGA package makes it appropriate for complex, high-pin-count applications where integration and predictable electrical/thermal characteristics are critical.

Designed within the Stratix V family, this device leverages documented electrical and switching characteristics from the datasheet to support systematic power and signal integrity planning, enabling scalable designs that require long-term robustness and package-level density.

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