5SGSED8K3F40C4N

The 5SGSED8K3F40C4N is an Intel Stratix V GS field‑programmable gate array (FPGA) in a 1517‑BBGA FCBGA package. Built on the Stratix V family architecture, this device combines a high logic count with abundant embedded memory and high‑speed transceiver and DSP capabilities to address data‑intensive and DSP‑centric designs.

Targeted use cases include bandwidth‑centric systems, transceiver‑based digital signal processing, and high‑performance communications applications where integration of logic, memory, DSP resources, and I/O density is required.

Key Features

• Core Logic  695,000 logic elements provide substantial programmable fabric for complex FPGA implementations.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM (total RAM bits: 51,200,000) for buffering, packet processing, and data staging.
• DSP and Transceiver Capability  Stratix V GS family devices include variable‑precision DSP blocks and integrated transceivers with up to 14.1‑Gbps data rate capability, enabling high‑precision DSP and transceiver‑based designs.
• I/O Density  696 user I/O pins to support complex board interfaces and high‑pin‑count connectivity.
• Package & Mounting  1517‑BBGA (FCBGA) package, supplier device package 1517‑FBGA (40×40), designed for surface‑mount assembly.
• Power  Core voltage supply range: 820 mV to 880 mV, enabling deployment within the specified core power envelope.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Family‑Level Architecture  Stratix V devices incorporate features such as adaptive logic modules (ALMs), 20‑Kbit embedded memory blocks, fractional PLLs, and customizable Embedded HardCopy Blocks for hardened IP instantiation.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑Performance DSP Systems  Ideal for DSP‑centric applications that require variable‑precision multipliers and extensive on‑chip memory for computation and buffering.
• Network & Optical Communications  Well suited for 40G/100G networking and optical interface designs that need integrated transceivers and high I/O density.
• Bandwidth‑Centric Protocols  Applicable to systems implementing high‑bandwidth protocols such as PCI Express Gen3 and other high‑throughput interfaces.
• Data‑Intensive Compute  Appropriate for compute‑heavy tasks in wireline, broadcast, and high‑performance computing environments that benefit from large logic and memory resources.

Unique Advantages

• High Logic Capacity: 695,000 logic elements enable large, complex designs and integration of multiple functions into a single device.
• Substantial On‑Chip Memory: Approximately 51.2 Mbits of embedded RAM supports deep buffering, packet processing, and memory‑intensive algorithms without immediate external memory dependence.
• Integrated DSP & Transceivers: Family‑level DSP blocks and 14.1‑Gbps capable transceivers reduce system BOM by consolidating high‑speed analog and digital functions on‑chip.
• High I/O Count: 696 I/O pins provide the interface density needed for multi‑lane transceivers, parallel buses, and complex mezzanine connections.
• Commercial‑Grade Reliability: Designed for commercial temperature ranges (0 °C to 85 °C) and RoHS compliance for mainstream production environments.

Why Choose 5SGSED8K3F40C4N?

The 5SGSED8K3F40C4N delivers a combination of high logic capacity, significant embedded memory, and family‑level DSP and transceiver features suited for data‑intensive and DSP‑centric designs. Its high I/O count and FCBGA packaging support dense board designs where integration and signal routing are critical.

This device is appropriate for engineering teams developing high‑throughput communications, signal processing, and compute‑focused systems who need a commercially graded, RoHS‑compliant FPGA with a well‑defined core voltage and operating temperature envelope.

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