5SGSED8K3F40C2L

The 5SGSED8K3F40C2L is an Intel Stratix V GS field-programmable gate array (FPGA) in a 1517-BBGA (1517-FBGA, 40×40) package designed for DSP-centric, transceiver-enabled designs. Built on the Stratix V family architecture, this GS variant targets high-performance digital signal processing and transceiver applications and provides a balance of logic capacity, embedded memory, and high-speed I/O.

Key on-chip resources for this device include 695,000 logic elements, approximately 51 Mbits of embedded memory, and 696 I/O pins. The device operates from a core supply range of 820 mV to 880 mV and is specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Process and Core Architecture  Stratix V family architecture implemented in 28‑nm process technology with adaptive logic modules and a comprehensive fabric clocking network.
• Logic Capacity  695,000 logic elements to implement complex control, packet-processing, and DSP pipelines.
• Embedded Memory  Approximately 51 Mbits of on-chip RAM organized in M20K-style blocks for high-bandwidth buffering and storage.
• Variable-Precision DSP  GS-family variable precision DSP blocks supporting up to 3,926 18×18 or 1,963 27×27 multipliers for numerically intensive signal processing.
• High-Speed Transceivers and I/O  Integrated transceivers with up to 14.1 Gbps capability (Stratix V GS devices) and 696 user I/Os to interface with high-throughput links and board-level peripherals.
• Clocking and PLLs  Fractional phase-locked loops (PLLs) included for flexible clock management and jitter control across the fabric and transceivers.
• Programmability and Hard IP  Embedded HardCopy block capability for hardened IP instantiation options such as PCIe (Gen1/Gen2/Gen3) where applicable to the Stratix V family.
• Package and Mounting  1517‑BBGA (1517‑FBGA, 40×40) surface-mount package suitable for compact, high-density PCB layouts.
• Power and Temperature  Core supply range of 820 mV–880 mV and commercial operating grade rated for 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-Performance DSP Systems  Implement complex filters, FFTs, and algorithm acceleration using abundant variable-precision DSP multipliers and large embedded RAM.
• Optical and Backplane Interfaces  Use integrated transceivers and large I/O count to handle high-bandwidth serial links and backplane protocols.
• Network and Packet Processing  Leverage high logic capacity and memory bandwidth to build packet engines, traffic management, and protocol offload functions.
• Broadcast and Military Communications  Deploy DSP-centric processing chains and high-speed interfaces for real-time media or communications signal chains (commercial-grade temperature).

Unique Advantages

• Large Logic Resource Count: 695,000 logic elements enable implementation of large-scale, complex designs without immediate partitioning across multiple devices.
• Rich DSP Fabric: Dedicated variable-precision DSP blocks (supporting up to 3,926 18×18 multipliers) accelerate compute-intensive signal processing tasks and reduce reliance on external accelerators.
• Substantial On-Chip Memory: Approximately 51 Mbits of embedded memory provide low-latency buffering and table storage for high-throughput data paths.
• High I/O and Transceiver Capability: 696 I/Os and integrated transceivers with 14.1 Gbps capability support demanding interface and link requirements without additional PHYs.
• Compact, Surface-Mount Packaging: 1517‑BBGA (40×40) package supports high-density PCB implementations while maintaining a high pin count for system connectivity.
• Commercial Grade and RoHS Compliance: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance simplify integration into mainstream electronic products.

Why Choose 5SGSED8K3F40C2L?

The 5SGSED8K3F40C2L delivers a combination of high logic density, extensive embedded memory, and DSP-rich resources within the Stratix V GS device family. Its integrated transceiver capability and large I/O complement applications that require both heavy signal processing and high-bandwidth connectivity.

This device is well suited for engineering teams developing DSP-centric communications, networking, and high-throughput data-processing systems that need on-chip compute and memory resources in a commercial-grade package backed by the Stratix V family architecture.

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