5SGSED8K2F40I3LNCV

The 5SGSED8K2F40I3LNCV is an Intel Stratix® V GS field programmable gate array (FPGA) delivered in a 1517-BBGA FCBGA package. It provides high logic capacity and substantial on-chip memory for designs that require large programmable resources in an industrial-temperature device.

With a core supply range of 820 mV to 880 mV, a wide operating temperature window, and a dense I/O complement, this device targets applications that need significant logic density, embedded memory, and extensive I/O integration.

Key Features

• Logic Capacity  Approximately 695,000 logic elements to implement complex digital designs and large-scale custom logic.
• Logic Blocks  About 262,400 logic blocks (LABs/CLBs) to structure and partition designs for performance and modularity.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, large-state machines, and on-chip data storage.
• I/O  696 I/Os to support extensive external interfaces, peripherals, and parallel connectivity.
• Power and Core Voltage  Core supply voltage range of 820 mV to 880 mV for compatible system power budgeting and thermal planning.
• Package and Mounting  1517-BBGA (FCBGA) supplier package (1517-FBGA 40×40) in a surface-mount form factor for dense board-level integration.
• Temperature Grade  Industrial-grade device rated for operation from –40 °C to 100 °C for deployment in thermally demanding environments.
• Standards Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density FPGA designs  Implement large-scale custom logic and complex state machines using the device’s 695,000 logic elements and substantial embedded RAM.
• Multi-interface systems  Support designs that require many parallel or serial interfaces via the device’s 696 I/Os.
• Industrial control and automation  Deploy in industrial environments that benefit from the device’s industrial temperature rating (–40 °C to 100 °C) and high integration density.

Unique Advantages

• High logic density: Large logic element count enables consolidation of multiple functions into a single device, reducing bill of materials and board complexity.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM supports deep buffering and data-intensive operations without external memory dependencies.
• Extensive I/O capability: 696 I/Os allow broad peripheral connectivity and flexible interface mapping for system-level integration.
• Industrial temperature range: Rated from –40 °C to 100 °C for reliable operation in harsh or temperature-variable installations.
• Compact, surface-mount package: 1517-BBGA (1517-FBGA 40×40) FCBGA package supports high-density PCB layouts and robust mechanical mounting.
• RoHS compliant: Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose 5SGSED8K2F40I3LNCV?

The 5SGSED8K2F40I3LNCV combines large programmable logic capacity, substantial embedded memory, and a high I/O count in an industrial-temperature, surface-mount FCBGA package. These characteristics make it suitable for engineers designing complex, high-density digital systems that require integrated memory and extensive external connectivity.

For teams focused on system integration and long-term design scalability, this Stratix® V GS device delivers the core resources and environmental range needed to support demanding embedded and industrial applications while aligning with common manufacturing compliance standards.

If you would like pricing, availability, or to request a formal quote for the 5SGSED8K2F40I3LNCV, submit an inquiry or request a quote through your preferred procurement channel.