5SGSED8K3F40C2G

The 5SGSED8K3F40C2G is a Stratix® V GS field-programmable gate array (FPGA) in a 1517-BBGA FCBGA package. It provides a high-density programmable fabric with extensive on-chip memory and a large I/O count for complex digital designs.

Engineered for commercial-temperature applications, this device combines 695,000 logic elements and approximately 51.2 Mbits of embedded memory with a high pin-count package and low-voltage core supply to support demanding system integration tasks.

Key Features

• Core logic — 695,000 logic elements to implement large-scale digital logic and complex FPGA architectures.
• Logic array resources — 262,400 reported logic array blocks to structure and partition designs efficiently.
• Embedded memory — Approximately 51.2 Mbits of on-chip RAM, enabling large buffering, state storage, and memory-intensive processing.
• I/O capacity — 696 user I/Os for high pin-count interfaces, board-level connectivity, and multi-channel designs.
• Power and supply — Core voltage supply range of 870 mV to 930 mV (0.87 V–0.93 V) to match system power rails and core-power planning.
• Package and mounting — 1517-BBGA, FCBGA (supplier package 1517-FBGA, 40×40); surface-mount device suitable for compact, high-density board designs.
• Temperature grade — Commercial operation rated from 0 °C to 85 °C for standard commercial deployments.
• Compliance — RoHS-compliant manufacturing status for regulatory and environmental consistency.

Typical Applications

• System prototyping and integration — Leverage the large logic count and abundant on-chip memory to prototype complex ASIC replacements or system-level hardware accelerators.
• High-density digital processing — Implement wide datapath processing, aggregation logic, and custom compute blocks that require significant LUT and RAM resources.
• Multi-interface platforms — Use the 696 I/Os to connect multiple peripherals, interfaces, and board-level channels in communication or instrumentation equipment.

Unique Advantages

• High logic capacity: 695,000 logic elements enable large designs and feature-rich implementations without immediate part scaling.
• Substantial embedded memory: Approximately 51.2 Mbits of RAM reduces external memory dependency for buffering and on-chip storage.
• Extensive I/O count: 696 I/Os simplify routing for multi-channel systems and dense board-level connectivity.
• Compact, high-pin-count package: 1517-BBGA FCBGA (1517-FBGA, 40×40) supports dense layouts while maintaining surface-mount assembly compatibility.
• Commercial temperature rating: Rated 0 °C–85 °C for mainstream commercial deployments where standard operating temperature is sufficient.
• RoHS-compliant: Meets environmental compliance expectations for commercial electronic products.

Why Choose 5SGSED8K3F40C2G?

The 5SGSED8K3F40C2G positions itself as a high-density Stratix® V GS FPGA option for commercial designs requiring substantial logic resources, on-chip memory, and high I/O counts in a single, surface-mount package. Its low-voltage core and large embedded memory make it suitable for complex digital processing tasks where on-chip resources reduce external component count.

Designers and procurement teams looking for a commercially graded FPGA with verified electrical characteristics and a high level of integration will find this device appropriate for system prototyping, digital acceleration, and multi-interface board designs. The supplied package and operating specifications provide a clear basis for power budgeting and thermal planning in commercial applications.

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