5SGSMD4K1F40C2N
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 19456000 360000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,245 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 135840 | Number of Logic Elements/Cells | 360000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGSMD4K1F40C2N – Stratix® V GS Field Programmable Gate Array (FPGA), 1517-BBGA
The 5SGSMD4K1F40C2N is a Stratix V GS-series FPGA built on a 28‑nm process that combines a high-capacity logic fabric with extensive DSP resources and integrated high-speed transceivers. It targets bandwidth- and DSP-centric applications such as 40G/100G networking, packet processing, broadcast, military communications, and high-performance computing.
Designed for commercial applications, this surface-mount FCBGA device offers a large logic array and on-chip memory alongside fractional PLLs and Embedded HardCopy capability to support prototyping and migration paths within the Stratix V family.
Key Features
- Logic Capacity 360,000 logic elements to implement large, complex digital designs.
- Embedded Memory Approximately 19.5 Mbits of on-chip RAM (total RAM bits: 19,456,000) using 20-Kbit (M20K) memory blocks.
- DSP Resources Abundance of variable-precision DSP blocks; GS devices support up to 3,926 18×18 or 1,963 27×27 multipliers for high-precision signal processing.
- High-Speed Transceivers Integrated transceivers with 14.1‑Gbps data-rate capability suitable for backplane and optical interfaces.
- I/O Density 696 user I/Os to support dense connectivity and system interfaces.
- Core & Fabric Redesigned adaptive logic modules (ALMs) and a multi-track routing architecture with comprehensive fabric clocking.
- Clocking & Timing Fractional phase-locked loops (PLLs) for flexible clock-domain management.
- Package & Mounting 1517‑BBGA (1517‑FBGA, 40×40) surface-mount FCBGA package for production assemblies.
- Power & Temperature Core supply range 870 mV to 930 mV; commercial operating range 0 °C to 85 °C.
- Embedded HardCopy Block Customizable hard IP block to support hardening of PCIe Gen3/Gen2/Gen1 implementations and ASIC migration paths.
Typical Applications
- Optical and Packet Transport High-bandwidth interfaces for 40G/100G transport and switching systems using integrated transceivers.
- High-Performance DSP Signal processing, filtering, and complex arithmetic workloads leveraging the abundant variable-precision DSP multipliers.
- Network Test and Measurement Backplane and optical interface applications that require high data rates and large logic/memory capacity.
- Broadcast and Military Communications Real-time processing and transceiver-based systems in wireline, broadcast, and military communication equipment.
Unique Advantages
- High logic and memory density: 360,000 logic elements and approximately 19.5 Mbits of on-chip RAM enable large implementations without excessive external memory.
- Dedicated DSP capacity: Variable-precision DSP blocks with thousands of multipliers accelerate compute-intensive signal-processing tasks.
- Integrated high-speed I/O: 14.1‑Gbps transceivers and 696 I/Os provide the bandwidth and connectivity required for modern communications and test systems.
- Flexible clocking and fabric: Fractional PLLs and a multi-track routing architecture simplify complex clock-domain and timing designs.
- Production-ready packaging: 1517‑BBGA (40×40) FCBGA surface-mount package suitable for volume assembly and deployment.
- Prototyping to ASIC path: Embedded HardCopy Block and Stratix V family compatibility support migration strategies toward HardCopy V ASICs.
Why Choose 5SGSMD4K1F40C2N?
The 5SGSMD4K1F40C2N combines substantial logic capacity, large on-chip memory, rich DSP resources, and integrated high-speed transceivers in a single commercial-grade Stratix V GS device. It is well suited for engineers developing transceiver-based, DSP-intensive systems that require both bandwidth and compute density.
With a 28‑nm Stratix V architecture, comprehensive fabric clocking, and an Embedded HardCopy path, this device offers a scalable platform for prototyping and production designs where migration options and on-chip integration are important considerations.
Request a quote or submit your requirements to receive pricing and availability information for the 5SGSMD4K1F40C2N.

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