5SGSMD4K1F40I2G

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 19456000 360000 1517-BBGA, FCBGA

Quantity 384 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4K1F40I2G – Stratix® V GS FPGA, 360,000 logic elements, 696 I/Os, 1517‑BBGA

The 5SGSMD4K1F40I2G is a Stratix® V GS Field Programmable Gate Array (FPGA) IC designed for industrial applications that require high logic density and extensive I/O. It delivers a large programmable fabric with embedded memory and a high pin-count package for complex, I/O‑intensive designs.

With 360,000 logic elements, approximately 19.456 Mbits of on‑chip RAM, and up to 696 I/Os in a 1517‑BBGA (1517‑FBGA supplier package, 40×40) surface‑mount package, this device targets systems that need substantial programmable logic capacity, broad connectivity, and industrial temperature operation.

Key Features

  • Core and Logic Capacity  Provides 360,000 logic elements suitable for large-scale programmable logic implementations and complex RTL designs.
  • Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM to support buffering, lookup tables, and data‑path storage within the FPGA fabric.
  • I/O and Connectivity  Up to 696 I/Os to support dense external connectivity and multi‑lane interfacing requirements.
  • Power  Core supply operating range from 870 mV to 930 mV to match system power‑rail requirements for the device core.
  • Package and Mounting  Available in a high‑pin‑count 1517‑BBGA (supplier device package: 1517‑FBGA, 40×40) surface‑mount package for compact board integration.
  • Temperature and Grade  Industrial temperature grade with an operating range of −40 °C to 100 °C for deployment in temperature‑challenging environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Control and Automation  High logic density and industrial temperature range enable complex control algorithms and I/O aggregation in factory and process control systems.
  • Communications Infrastructure  Large logic and abundant I/Os make the device suitable for packet processing, protocol handling, and interface bridging in networking equipment.
  • High‑density Data Processing  Embedded memory and extensive logic resources support data buffering, real‑time processing, and custom accelerators in compute‑intensive applications.
  • Prototyping and Custom Hardware  Use as a development platform for high‑capacity custom logic implementations and ASIC prototyping where large programmable fabric and many I/Os are required.

Unique Advantages

  • High logic integration: 360,000 logic elements enable consolidation of large amounts of logic into a single device, reducing board count.
  • Substantial embedded memory: Approximately 19.456 Mbits of on‑chip RAM supports internal buffering and state storage without external memory for many designs.
  • Extensive I/O capacity: Up to 696 I/Os provides flexibility to interface with multiple peripherals, sensors, and high‑pin‑count systems.
  • Industrial temperature operation: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
  • Compact, high‑pin package: 1517‑BBGA (1517‑FBGA supplier package, 40×40) surface‑mount package delivers high pin density in a space‑efficient footprint.
  • Low core voltage operation: Core supply range of 870 mV to 930 mV supports modern power architectures and efficient core power delivery.
  • Standards‑aligned manufacturing: RoHS compliance for regulatory and environmental requirements.

Why Choose 5SGSMD4K1F40I2G?

The 5SGSMD4K1F40I2G positions itself as a high‑capacity FPGA solution for designs that demand a large programmable fabric, significant embedded memory, and a broad complement of I/Os within an industrial temperature envelope. Its combination of 360,000 logic elements, approximately 19.456 Mbits of on‑chip RAM, and 696 I/Os in a 1517‑BBGA package supports consolidation of complex system functions onto a single device.

This device is well suited to engineers and system designers building industrial control, communications, and high‑density data processing platforms who require scalability, strong I/O capability, and adherence to industrial operating conditions. The device’s specifications provide a clear basis for selecting it where logic density, memory capacity, and package pin count are primary selection criteria.

Request a quote or contact sales to discuss availability, lead times, and pricing for the 5SGSMD4K1F40I2G.

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