5SGSMD4K1F40I2G
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 19456000 360000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 384 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 135840 | Number of Logic Elements/Cells | 360000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGSMD4K1F40I2G – Stratix® V GS FPGA, 360,000 logic elements, 696 I/Os, 1517‑BBGA
The 5SGSMD4K1F40I2G is a Stratix® V GS Field Programmable Gate Array (FPGA) IC designed for industrial applications that require high logic density and extensive I/O. It delivers a large programmable fabric with embedded memory and a high pin-count package for complex, I/O‑intensive designs.
With 360,000 logic elements, approximately 19.456 Mbits of on‑chip RAM, and up to 696 I/Os in a 1517‑BBGA (1517‑FBGA supplier package, 40×40) surface‑mount package, this device targets systems that need substantial programmable logic capacity, broad connectivity, and industrial temperature operation.
Key Features
- Core and Logic Capacity Provides 360,000 logic elements suitable for large-scale programmable logic implementations and complex RTL designs.
- Embedded Memory Approximately 19.456 Mbits of on‑chip RAM to support buffering, lookup tables, and data‑path storage within the FPGA fabric.
- I/O and Connectivity Up to 696 I/Os to support dense external connectivity and multi‑lane interfacing requirements.
- Power Core supply operating range from 870 mV to 930 mV to match system power‑rail requirements for the device core.
- Package and Mounting Available in a high‑pin‑count 1517‑BBGA (supplier device package: 1517‑FBGA, 40×40) surface‑mount package for compact board integration.
- Temperature and Grade Industrial temperature grade with an operating range of −40 °C to 100 °C for deployment in temperature‑challenging environments.
- Compliance RoHS compliant.
Typical Applications
- Industrial Control and Automation High logic density and industrial temperature range enable complex control algorithms and I/O aggregation in factory and process control systems.
- Communications Infrastructure Large logic and abundant I/Os make the device suitable for packet processing, protocol handling, and interface bridging in networking equipment.
- High‑density Data Processing Embedded memory and extensive logic resources support data buffering, real‑time processing, and custom accelerators in compute‑intensive applications.
- Prototyping and Custom Hardware Use as a development platform for high‑capacity custom logic implementations and ASIC prototyping where large programmable fabric and many I/Os are required.
Unique Advantages
- High logic integration: 360,000 logic elements enable consolidation of large amounts of logic into a single device, reducing board count.
- Substantial embedded memory: Approximately 19.456 Mbits of on‑chip RAM supports internal buffering and state storage without external memory for many designs.
- Extensive I/O capacity: Up to 696 I/Os provides flexibility to interface with multiple peripherals, sensors, and high‑pin‑count systems.
- Industrial temperature operation: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
- Compact, high‑pin package: 1517‑BBGA (1517‑FBGA supplier package, 40×40) surface‑mount package delivers high pin density in a space‑efficient footprint.
- Low core voltage operation: Core supply range of 870 mV to 930 mV supports modern power architectures and efficient core power delivery.
- Standards‑aligned manufacturing: RoHS compliance for regulatory and environmental requirements.
Why Choose 5SGSMD4K1F40I2G?
The 5SGSMD4K1F40I2G positions itself as a high‑capacity FPGA solution for designs that demand a large programmable fabric, significant embedded memory, and a broad complement of I/Os within an industrial temperature envelope. Its combination of 360,000 logic elements, approximately 19.456 Mbits of on‑chip RAM, and 696 I/Os in a 1517‑BBGA package supports consolidation of complex system functions onto a single device.
This device is well suited to engineers and system designers building industrial control, communications, and high‑density data processing platforms who require scalability, strong I/O capability, and adherence to industrial operating conditions. The device’s specifications provide a clear basis for selecting it where logic density, memory capacity, and package pin count are primary selection criteria.
Request a quote or contact sales to discuss availability, lead times, and pricing for the 5SGSMD4K1F40I2G.

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