5SGSMD4K1F40C2WN

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 19456000 360000 1517-BBGA, FCBGA

Quantity 974 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4K1F40C2WN – Stratix® V GS FPGA (360,000 Logic Elements, 1517-FBGA)

The 5SGSMD4K1F40C2WN is a Stratix® V GS Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package. It delivers a large logic capacity and extensive I/O in a surface-mount, high-pin-count package suitable for commercial-grade FPGA system designs.

This device targets applications that require substantial on-chip logic and memory resources together with a high number of I/O signals, offering designers a compact, RoHS-compliant FPGA option with well-defined operating voltage and temperature ranges.

Key Features

  • Core Logic Capacity  360,000 logic elements providing significant programmable logic resource for complex digital designs.
  • Logic Array Blocks  135,840 logic array blocks to structure and allocate logic functions efficiently across the device.
  • Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms.
  • I/O Density  696 user I/O pins to support high-pin-count interfaces and multi-channel connectivity.
  • Power and Core Supply  Core supply voltage specified at 870 mV to 930 mV for established power-domain design and sequencing.
  • Package and Mounting  1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for compact board-level integration.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for commercial-environment deployments.
  • Environmental Compliance  RoHS compliant to meet standard lead-free manufacturing requirements.

Typical Applications

  • High-density digital processing  Use the device where large amounts of programmable logic and embedded memory are needed for custom data-paths and control logic.
  • Multi‑I/O interface hubs  Leverage 696 I/O pins to aggregate and route multiple high-pin-count interfaces on a single FPGA.
  • Compact system designs  The 1517-FBGA package and surface-mount mounting enable integration in space-constrained commercial products.

Unique Advantages

  • Substantial programmable logic: 360,000 logic elements deliver the capacity to implement complex finite-state machines, datapaths, and custom accelerators without immediate external logic.
  • On-chip embedded memory: Approximately 19.46 Mbits of RAM reduces reliance on external memory for buffering and local storage, simplifying BOM and board routing.
  • High I/O count: 696 I/Os provide flexibility to interface with multiple peripherals, sensors, and high-density connectors directly.
  • Clear power envelope: Defined core supply range (870–930 mV) supports deterministic power planning and sequencing for system-level design.
  • Commercial temperature rating: Specified 0 °C to 85 °C operation aligns the device with a wide range of commercial electronics applications.
  • RoHS compliant: Ready for lead-free production processes to meet common environmental and manufacturing requirements.

Why Choose 5SGSMD4K1F40C2WN?

The 5SGSMD4K1F40C2WN provides a balanced combination of high logic density, substantial embedded memory, and a very large I/O count in a compact 1517-FBGA surface-mount package. Its commercial temperature rating and RoHS compliance make it suitable for a broad set of commercial FPGA system designs where on-chip resources and board-level integration density matter.

This part is well suited to designers who need scalable programmable logic capacity alongside significant on-chip RAM and extensive I/O, while maintaining clear electrical and thermal design parameters (core voltage 870–930 mV, 0 °C to 85 °C). The packaging and resource set support compact, high-functionality boards and streamlined BOM choices.

Request a quote or submit a pricing inquiry to evaluate the 5SGSMD4K1F40C2WN for your next commercial FPGA design project.

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