5SGSMD4K1F40C2WN
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 19456000 360000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 974 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 135840 | Number of Logic Elements/Cells | 360000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGSMD4K1F40C2WN – Stratix® V GS FPGA (360,000 Logic Elements, 1517-FBGA)
The 5SGSMD4K1F40C2WN is a Stratix® V GS Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package. It delivers a large logic capacity and extensive I/O in a surface-mount, high-pin-count package suitable for commercial-grade FPGA system designs.
This device targets applications that require substantial on-chip logic and memory resources together with a high number of I/O signals, offering designers a compact, RoHS-compliant FPGA option with well-defined operating voltage and temperature ranges.
Key Features
- Core Logic Capacity 360,000 logic elements providing significant programmable logic resource for complex digital designs.
- Logic Array Blocks 135,840 logic array blocks to structure and allocate logic functions efficiently across the device.
- Embedded Memory Approximately 19.46 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms.
- I/O Density 696 user I/O pins to support high-pin-count interfaces and multi-channel connectivity.
- Power and Core Supply Core supply voltage specified at 870 mV to 930 mV for established power-domain design and sequencing.
- Package and Mounting 1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for compact board-level integration.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation for commercial-environment deployments.
- Environmental Compliance RoHS compliant to meet standard lead-free manufacturing requirements.
Typical Applications
- High-density digital processing Use the device where large amounts of programmable logic and embedded memory are needed for custom data-paths and control logic.
- Multi‑I/O interface hubs Leverage 696 I/O pins to aggregate and route multiple high-pin-count interfaces on a single FPGA.
- Compact system designs The 1517-FBGA package and surface-mount mounting enable integration in space-constrained commercial products.
Unique Advantages
- Substantial programmable logic: 360,000 logic elements deliver the capacity to implement complex finite-state machines, datapaths, and custom accelerators without immediate external logic.
- On-chip embedded memory: Approximately 19.46 Mbits of RAM reduces reliance on external memory for buffering and local storage, simplifying BOM and board routing.
- High I/O count: 696 I/Os provide flexibility to interface with multiple peripherals, sensors, and high-density connectors directly.
- Clear power envelope: Defined core supply range (870–930 mV) supports deterministic power planning and sequencing for system-level design.
- Commercial temperature rating: Specified 0 °C to 85 °C operation aligns the device with a wide range of commercial electronics applications.
- RoHS compliant: Ready for lead-free production processes to meet common environmental and manufacturing requirements.
Why Choose 5SGSMD4K1F40C2WN?
The 5SGSMD4K1F40C2WN provides a balanced combination of high logic density, substantial embedded memory, and a very large I/O count in a compact 1517-FBGA surface-mount package. Its commercial temperature rating and RoHS compliance make it suitable for a broad set of commercial FPGA system designs where on-chip resources and board-level integration density matter.
This part is well suited to designers who need scalable programmable logic capacity alongside significant on-chip RAM and extensive I/O, while maintaining clear electrical and thermal design parameters (core voltage 870–930 mV, 0 °C to 85 °C). The packaging and resource set support compact, high-functionality boards and streamlined BOM choices.
Request a quote or submit a pricing inquiry to evaluate the 5SGSMD4K1F40C2WN for your next commercial FPGA design project.

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