5SGSMD6N2F45C2G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA

Quantity 1,064 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSMD6N2F45C2G – Stratix® V GS FPGA, 583,000 logic elements

The 5SGSMD6N2F45C2G is an Intel Stratix® V GS field programmable gate array (FPGA) supplied in a high-pin-count FCBGA package for commercial designs. It delivers high logic density, substantial embedded memory, and a large number of general-purpose I/Os for complex digital systems that require significant on-chip resources.

Key delivered specifications include 583,000 logic elements, approximately 46 Mbits of embedded memory, 840 I/O pins, and operation across a commercial temperature range with a low-voltage core supply. The device is RoHS compliant and provided in a 1932-ball FCBGA (45×45 mm) surface-mount package.

Key Features

  • High-density core — 583,000 logic elements provide substantial programmable fabric for complex logic, DSP, and control functions.
  • Embedded memory — Approximately 46 Mbits of on-chip RAM to support large buffers, FIFOs, and data-path storage without external memory for many functions.
  • Extensive I/O — 840 I/O pins enable wide parallel interfaces and numerous peripheral connections.
  • Package and mounting — Supplied in a 1932-BBGA FCBGA package (supplier package: 1932-FBGA, FC 45×45) designed for surface-mount PCB assembly.
  • Core voltage — Low-voltage core supply range from 870 mV to 930 mV to match system power rails and power budgeting requirements.
  • Commercial temperature grade — Rated for 0°C to 85°C operation for standard commercial environments.
  • Regulatory — RoHS compliant.

Unique Advantages

  • High on-chip integration: Large logic element count and ~46 Mbits of embedded memory reduce dependence on external devices and simplify board-level design.
  • Extensive connectivity: 840 I/Os support wide parallel buses and multiple peripheral interfaces, enabling flexible system partitioning.
  • Compact, high-pin-count package: 1932-ball FCBGA (45×45 mm) provides a dense pinout for routing high-bandwidth signals while keeping overall PCB footprint efficient.
  • Power-optimized core range: 870 mV–930 mV core voltage allows integration into modern low-voltage power domains.
  • Commercial-ready: Specified 0°C–85°C operating range and RoHS compliance for general-purpose commercial products and systems.

Why Choose 5SGSMD6N2F45C2G?

The 5SGSMD6N2F45C2G positions itself as a high-density Stratix V GS FPGA option for commercial designs that require large programmable logic capacity, significant on-chip RAM, and broad I/O capability in a compact FCBGA package. Its low-voltage core supply and RoHS compliance make it suitable for contemporary power- and regulatory-aware systems.

Design teams targeting complex digital signal processing, data-path aggregation, or multi-interface controllers can leverage the device’s combination of logic density, embedded memory, and I/O count to consolidate functionality and reduce board-level component count while benefitting from the Stratix V family documentation and specifications.

Request a quote or submit an inquiry to purchase the 5SGSMD6N2F45C2G and receive pricing and availability information for your design needs.

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