5SGSMD6N1F45C2LN

The 5SGSMD6N1F45C2LN is a Stratix V GS FPGA packaged in a 1932-ball FCBGA package. It provides a high logic element count, abundant I/O, and substantial on‑chip RAM to support dense, configurable digital designs within commercial temperature ranges.

This device is suited for designs that require large programmable logic capacity, a high number of external interfaces, and a compact BGA package while operating within a commercial voltage and temperature envelope.

Key Features

• Core Logic  Approximately 583,000 logic elements to implement complex, high-density logic and custom processing functions.
• Embedded Memory  Approximately 46.08 Mbits of total on-chip RAM for FIFOs, buffers, and local data storage.
• High I/O Count  840 I/O pins to support extensive peripheral and interface connectivity.
• Power Supply  Core voltage supply range of 820 mV to 880 mV consistent with Stratix V GS device requirements.
• Package  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45) for high-density board integration.
• Mounting & Grade  Surface-mount FCBGA in a commercial-grade offering with an operating temperature range of 0°C to 85°C.
• Standards & Compliance  RoHS compliant.

Typical Applications

• High-density logic designs  For projects that require up to 583,000 logic elements to implement complex programmable logic and algorithm acceleration.
• I/O‑intensive systems  Ideal where a large number of external interfaces are needed—this device provides 840 I/Os for broad connectivity.
• On‑chip buffering and storage  Use the approximately 46.08 Mbits of embedded memory for local buffering, packet queuing, or intermediate result storage.
• Commercial deployments  Designed for applications operating within a 0°C to 85°C temperature range and commercial-grade requirements.

Unique Advantages

• Large programmable fabric: The substantial logic element count supports complex implementations without immediate need for external programmable logic.
• Extensive external connectivity: 840 I/Os reduce the need for external multiplexing and simplify board-level interface routing.
• Significant embedded RAM: Approximately 46.08 Mbits of on-chip memory enables local data handling and reduces system memory bandwidth demands.
• Compact, high-density package: The 1932‑ball FCBGA (1932-FBGA, FC (45×45)) offers a dense footprint for space-constrained system designs.
• Controlled power envelope: A defined supply range of 820–880 mV enables predictable power design and sequencing for system integration.
• RoHS compliant: Meets environmental compliance expectations for modern electronics manufacturing.

Why Choose 5SGSMD6N1F45C2LN?

The 5SGSMD6N1F45C2LN positions itself as a high-capacity Stratix V GS FPGA option for designers needing large logic density, broad I/O, and substantial embedded memory in a single commercial-grade FCBGA package. Its defined voltage and temperature ranges make it straightforward to integrate into commercial systems where on‑chip resources and I/O count are critical design drivers.

This device is appropriate for engineering teams and procurement seeking a scalable, high-density programmable platform backed by the Stratix V device family specifications and datasheet guidance.

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