5SGSMD6K3F40I4N

The 5SGSMD6K3F40I4N is an Intel Stratix® V GS field-programmable gate array (FPGA) in a 1517-BBGA FCBGA package. It delivers a high-density programmable fabric with substantial on-chip memory and a large I/O complement for complex digital designs.

This industrial-temperature FPGA is targeted at designs that require hundreds of thousands of logic elements, significant embedded RAM, and a compact surface-mount BGA package for system integration where performance and board-level density matter.

Key Features

• Logic Capacity 583,000 logic elements (cells) to implement large-scale digital designs and complex custom logic.
• Embedded Memory Approximately 46 Mbits of on-chip RAM for buffering, packet processing, and data-path acceleration.
• I/O Resources 696 user I/O pins to support wide parallel interfaces and high-pin-count system connections.
• Power / Core Supply Core voltage range specified at 820 mV to 880 mV for the device core supply.
• Package & Mounting 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting type suitable for standard PCB assembly flows.
• Temperature & Grade Industrial grade operation from –40°C to 100°C for deployments requiring extended temperature range.
• Compliance RoHS compliant.

Typical Applications

• Communications and Networking — Implements packet processing, protocol engines, and wide parallel I/O interfaces where large logic capacity and embedded RAM are required.
• High‑Performance Compute Acceleration — Suitable for offload or accelerator functions that need substantial programmable logic and memory close to the processing pipeline.
• Industrial Control Systems — Supports complex control logic and sensor/actuator interfacing across a wide operating temperature range.
• Prototyping and System Integration — High logic density and large I/O count make this device useful for system prototyping and integration of custom hardware functions.

Unique Advantages

• High logic density: 583,000 logic elements enable implementation of large, integrated digital subsystems on a single FPGA.
• Substantial embedded memory: Approximately 46 Mbits of on-chip RAM reduces external memory dependence and improves data-path latency.
• Large I/O footprint: 696 I/O pins provide flexibility for parallel interfaces, wide buses, and multiple high-pin-count peripherals.
• Industrial temperature rating: –40°C to 100°C operation supports deployment in temperature-challenging environments.
• Compact BGA packaging: 1517-BBGA (1517-FBGA, 40×40) surface-mount package delivers board-level density while maintaining a robust assembly form factor.
• Controlled core voltage range: 820 mV to 880 mV core supply specification for compatible power-rail design and predictable operation.

Why Choose 5SGSMD6K3F40I4N?

The 5SGSMD6K3F40I4N combines a large programmable fabric with significant on-chip RAM and a high I/O count in an industrial-temperature Stratix V GS device. Its configuration is well suited to engineers building complex digital systems that require integration of substantial logic, memory, and peripheral connectivity in a single FPGA.

As an Intel Stratix V GS part in a 1517-BBGA surface-mount package, this device positions designs for scalable performance and compact board-level implementation while meeting RoHS requirements and extended temperature needs.

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