5SGSMD6K3F40I4G

The 5SGSMD6K3F40I4G is a Stratix V GS series FPGA in a 1517-BBGA FCBGA package, offering very large logic capacity and high I/O density for industrial applications. It provides a combination of high logic element count, substantial on-chip RAM, and an extensive I/O complement for complex, high-density digital designs.

This device is targeted at designs that require large-scale programmable logic, significant embedded memory, and robust thermal/voltage operating margins—backed by industrial temperature grading and a compact surface-mount BGA package.

Key Features

• High Logic Capacity — 583,000 logic elements to implement large custom logic fabrics, complex datapaths, and extensive control logic.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage without external memory in some designs.
• Extensive I/O — 696 I/O pins to support dense connectivity to peripherals, high-pin-count interfaces, and multi-channel systems.
• Package and Mounting — 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), optimized for surface-mount assembly in compact system boards.
• Power and Core Voltage — Core supply range of 820 mV to 880 mV, enabling integration into power-optimized designs that follow low-voltage core rails.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for systems that require extended ambient-range operation.
• Regulatory Compliance — RoHS-compliant construction for compatibility with standard industrial manufacturing and environmental requirements.

Typical Applications

• High-density data processing — Use the large logic element count and embedded RAM to implement custom accelerators, packet processing, or complex state machines.
• Telecom and networking equipment — High I/O count enables connectivity for multi-channel interfaces, protocol bridging, and board-level aggregation.
• Industrial control systems — Industrial temperature rating and robust packaging suit demanding control and automation applications that require reliability over a wide temperature range.
• Prototyping and system integration — Large logic and memory resources provide headroom for iterative hardware/software co-design and integration of multiple functions on a single device.

Unique Advantages

• Large on-chip resources: 583,000 logic elements and approximately 46 Mbits of embedded RAM reduce dependence on external logic and memory, simplifying board-level design.
• High connectivity: 696 I/O pins provide flexibility for complex interfaces and multi-peripheral systems without extensive external multiplexing.
• Industrial robustness: −40 °C to 100 °C operating range and RoHS compliance support deployment in industrial environments with standard environmental controls.
• Compact, assembly-friendly package: 1517-BBGA (FCBGA) in a 40×40 footprint supports high-density board layouts and surface-mount assembly processes.
• Deterministic core voltage range: Defined 820–880 mV supply range aids in power budgeting and thermal planning for system integrators.

Why Choose 5SGSMD6K3F40I4G?

The 5SGSMD6K3F40I4G balances very large programmable logic capacity, substantial embedded memory, and a high I/O count in a compact FCBGA package rated for industrial temperatures. It is well suited to engineering teams building feature-dense FPGA-based subsystems where on-chip resources and board-level connectivity are primary requirements.

For designs that demand scalability, integration, and reliable operation across a wide temperature range, this Stratix V GS device offers a verifiable specification set—large logic and memory resources, a clearly defined core voltage range, and a manufacturable BGA package—helping reduce BOM complexity and accelerate integration into production hardware.

Request a quote or submit a pricing and availability inquiry to evaluate 5SGSMD6K3F40I4G for your next high-density FPGA design.