5SGSMD6K3F40I3LG

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA

Quantity 384 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSMD6K3F40I3LG – Stratix® V GS FPGA, 1517-BBGA FCBGA

The 5SGSMD6K3F40I3LG is a Stratix V GS Field Programmable Gate Array (FPGA) from Intel, supplied in a 1517-BBGA FCBGA package. It delivers high logic density and large embedded memory capacity in an industrial-grade, surface-mount package.

With approximately 583,000 logic elements, roughly 46 Mbits of embedded RAM, and 696 user I/O pins, this device is engineered for complex, I/O‑rich digital designs and industrial applications that require significant on-chip resources and robust operating range.

Key Features

  • Core & Logic  Approximately 583,000 logic elements providing substantial programmable logic capacity for large-scale designs.
  • Logic Array Blocks  220,000 LABs for structured logic implementation and partitioning of design resources.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, large FIFOs, and memory-intensive functions.
  • I/O Density  696 user I/O pins to accommodate wide parallel interfaces, multiple buses, and extensive peripheral connectivity.
  • Power  Specified core voltage supply range from 820 mV to 880 mV for core power planning and supply design.
  • Package & Mounting  1517-BBGA FCBGA package (supplier device package 1517-FBGA, 40×40) in a surface-mount form factor for high-density PCB assembly.
  • Temperature & Grade  Industrial grade with operating temperature from −40 °C to 100 °C for deployment in demanding environments.
  • Regulatory  RoHS compliant.

Typical Applications

  • Industrial Control  Large programmable logic resources and industrial temperature rating suit complex control systems and factory automation.
  • High‑Performance Signal Processing  High logic capacity and substantial on-chip RAM enable implementation of filtering, transforms, and real‑time data paths.
  • Communications Infrastructure  Dense I/O and large logic fabric support protocol handling and packet processing in network equipment.
  • Data Acquisition & Aggregation  Numerous I/Os and embedded memory allow wide-channel sensor interfacing and local data buffering.

Unique Advantages

  • High logic capacity: Approximately 583,000 logic elements let you integrate complex functions on a single device, reducing board-level component count.
  • Significant embedded memory: Approximately 46 Mbits of on-chip RAM minimizes external memory dependency and improves latency for buffering and streaming data.
  • Extensive I/O: 696 I/O pins provide flexibility for parallel interfaces and multiple peripherals without excessive design compromises.
  • Industrial robustness: Rated for −40 °C to 100 °C, the device supports deployment in temperature-critical industrial environments.
  • Compact package: 1517-BBGA FCBGA surface-mount package enables high-density PCB layouts while maintaining a large resource set.
  • Standards‑aware supply: RoHS compliance helps meet regulatory and manufacturing requirements.

Why Choose 5SGSMD6K3F40I3LG?

The 5SGSMD6K3F40I3LG positions itself as a high-capacity, industrial-grade Stratix V GS FPGA suitable for designs that demand large programmable logic, abundant on-chip memory, and wide I/O. Its combination of logic density, embedded RAM, and I/O count enables consolidation of multiple functions onto a single device, simplifying system architecture and reducing bill-of-materials complexity.

This device is well suited to engineering teams designing industrial systems, communications infrastructure, and high-performance signal processing applications that require a robust operating range, surface-mount packaging, and compliance with RoHS requirements.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGSMD6K3F40I3LG.

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