5SGSMD6K3F40I3LG
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 384 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSMD6K3F40I3LG – Stratix® V GS FPGA, 1517-BBGA FCBGA
The 5SGSMD6K3F40I3LG is a Stratix V GS Field Programmable Gate Array (FPGA) from Intel, supplied in a 1517-BBGA FCBGA package. It delivers high logic density and large embedded memory capacity in an industrial-grade, surface-mount package.
With approximately 583,000 logic elements, roughly 46 Mbits of embedded RAM, and 696 user I/O pins, this device is engineered for complex, I/O‑rich digital designs and industrial applications that require significant on-chip resources and robust operating range.
Key Features
- Core & Logic Approximately 583,000 logic elements providing substantial programmable logic capacity for large-scale designs.
- Logic Array Blocks 220,000 LABs for structured logic implementation and partitioning of design resources.
- Embedded Memory Approximately 46 Mbits of on-chip RAM to support buffering, large FIFOs, and memory-intensive functions.
- I/O Density 696 user I/O pins to accommodate wide parallel interfaces, multiple buses, and extensive peripheral connectivity.
- Power Specified core voltage supply range from 820 mV to 880 mV for core power planning and supply design.
- Package & Mounting 1517-BBGA FCBGA package (supplier device package 1517-FBGA, 40×40) in a surface-mount form factor for high-density PCB assembly.
- Temperature & Grade Industrial grade with operating temperature from −40 °C to 100 °C for deployment in demanding environments.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control Large programmable logic resources and industrial temperature rating suit complex control systems and factory automation.
- High‑Performance Signal Processing High logic capacity and substantial on-chip RAM enable implementation of filtering, transforms, and real‑time data paths.
- Communications Infrastructure Dense I/O and large logic fabric support protocol handling and packet processing in network equipment.
- Data Acquisition & Aggregation Numerous I/Os and embedded memory allow wide-channel sensor interfacing and local data buffering.
Unique Advantages
- High logic capacity: Approximately 583,000 logic elements let you integrate complex functions on a single device, reducing board-level component count.
- Significant embedded memory: Approximately 46 Mbits of on-chip RAM minimizes external memory dependency and improves latency for buffering and streaming data.
- Extensive I/O: 696 I/O pins provide flexibility for parallel interfaces and multiple peripherals without excessive design compromises.
- Industrial robustness: Rated for −40 °C to 100 °C, the device supports deployment in temperature-critical industrial environments.
- Compact package: 1517-BBGA FCBGA surface-mount package enables high-density PCB layouts while maintaining a large resource set.
- Standards‑aware supply: RoHS compliance helps meet regulatory and manufacturing requirements.
Why Choose 5SGSMD6K3F40I3LG?
The 5SGSMD6K3F40I3LG positions itself as a high-capacity, industrial-grade Stratix V GS FPGA suitable for designs that demand large programmable logic, abundant on-chip memory, and wide I/O. Its combination of logic density, embedded RAM, and I/O count enables consolidation of multiple functions onto a single device, simplifying system architecture and reducing bill-of-materials complexity.
This device is well suited to engineering teams designing industrial systems, communications infrastructure, and high-performance signal processing applications that require a robust operating range, surface-mount packaging, and compliance with RoHS requirements.
Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGSMD6K3F40I3LG.

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