5SGSMD6K3F40I3LN

The 5SGSMD6K3F40I3LN is a Stratix® V GS field-programmable gate array (FPGA) IC designed for high-density logic and memory-centric designs. This industrial-grade device integrates approximately 583,000 logic elements, roughly 46.08 Mbits of embedded memory, and a large I/O count to support complex, I/O‑heavy systems.

Packaged in a 1517‑BBGA FCBGA (1517‑FBGA, 40×40) surface-mount package and specified for a core supply range of 820 mV to 880 mV, the device targets applications that require high integration, significant on‑chip RAM, and broad I/O connectivity within an industrial operating temperature range.

Key Features

• Core Logic  Approximately 583,000 logic elements for implementing large, densely packed digital designs.
• Embedded Memory  Approximately 46.08 Mbits of on‑chip RAM to support memory‑intensive functions and buffering.
• I/O Capacity  696 general-purpose I/Os to accommodate wide parallel interfaces, multi-channel connectivity, and board-level integration.
• Package & Mounting  1517‑BBGA FCBGA package (supplier package: 1517‑FBGA, 40×40) in a surface‑mount form factor for high‑density PCB layouts.
• Power  Core voltage supply specified from 820 mV to 880 mV to match system power-rail design requirements.
• Operating Temperature & Grade  Industrial grade with operating temperature from −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• High‑density digital processing  Large logic capacity and extensive on‑chip RAM enable implementation of complex state machines, DSP pipelines, and custom accelerators.
• Memory‑intensive systems  Approximately 46 Mbits of embedded memory supports buffering, packet queues, and data staging for throughput‑sensitive designs.
• Multi‑interface control and aggregation  696 I/Os allow broad parallel interfacing, board-level aggregation, and integration of multiple peripheral channels.
• Industrial control and automation  Industrial temperature rating and surface‑mount 1517‑BBGA package suit ruggedized controller and subsystem designs.

Unique Advantages

• High integration density: Consolidates large amounts of logic and memory on a single device, reducing PCB BOM and system footprint.
• Extensive I/O resources: Nearly 700 I/Os simplify board partitioning and reduce need for external I/O expanders.
• Industrial temperature tolerance: Rated for −40 °C to 100 °C operation to support deployments in temperature‑challenging environments.
• Compact, manufacturable package: 1517‑BBGA FCBGA surface‑mount package supports high‑density PCB assembly and reliable soldering processes.
• Predictable power requirements: Defined core supply range (820 mV–880 mV) enables straightforward power‑rail design and thermal planning.
• Regulatory readiness: RoHS compliance for lead‑free manufacturing and environmental requirements.

Why Choose 5SGSMD6K3F40I3LN?

The 5SGSMD6K3F40I3LN positions itself for designs that require significant on‑chip logic, abundant embedded memory, and large I/O capacity within an industrial temperature envelope. Its combination of approximately 583,000 logic elements and roughly 46 Mbits of embedded RAM makes it well suited for data‑heavy, high‑integration subsystems where board‑level consolidation and I/O density are priorities.

As a member of the Stratix V family, this device is supplied with detailed device documentation and electrical characteristics to support integration into complex systems. It is a practical choice for engineering teams building industrial controllers, communication aggregation modules, and advanced processing accelerators that demand robust thermal range, defined core power rails, and high I/O counts.

Request a quote or submit an inquiry to start integrating the 5SGSMD6K3F40I3LN into your next high‑density FPGA design.