5SGSMD6K3F40I3G

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA

Quantity 537 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSMD6K3F40I3G – Stratix® V GS FPGA, 583,000 logic elements, ~46 Mbits RAM, 696 I/Os, 1517-BBGA

The 5SGSMD6K3F40I3G is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel. It provides high on-chip logic capacity and embedded memory in a 1517-ball FCBGA package for surface-mount board designs.

With 583,000 logic elements, approximately 46 Mbits of embedded RAM, and 696 I/Os, this industrial-grade device targets complex designs that require large logic capacity, substantial on-chip memory, and extensive I/O connectivity while operating across an industrial temperature range.

Key Features

  • Core Density  583,000 logic elements (logic cells) for high-capacity logic integration and complex programmable functions.
  • On-chip Memory  Approximately 46 Mbits of total RAM bits to support large buffering, state machines, and on-chip data storage.
  • I/O Count  696 available I/Os to support wide peripheral, interface, and system-level connectivity without external multiplexing.
  • Power Supply  Core voltage supply range of 820 mV to 880 mV for core power planning and regulator selection.
  • Package & Mounting  1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for dense PCB implementations.
  • Temperature & Grade  Industrial grade operation with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
  • Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

  • High logic capacity: 583,000 logic elements enable integration of complex digital functions and large custom logic blocks on a single device.
  • Substantial embedded memory: Approximately 46 Mbits of on-chip RAM reduce reliance on external memory for many buffering and storage tasks.
  • Extensive I/O resources: 696 I/Os provide flexibility for multi-protocol interfaces, sensor arrays, and parallel data paths.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in industrial and temperature-challenging applications.
  • Compact FCBGA footprint: 1517-ball FCBGA (40×40) package supports high-density PCB layouts while maintaining robust solderable mounting.
  • Low-voltage core operation: 820–880 mV core range enables efficient core power design and fine-grained supply management.

Why Choose 5SGSMD6K3F40I3G?

The 5SGSMD6K3F40I3G combines high logic density, significant embedded memory, and a large I/O count in an industrial-grade Stratix V GS FPGA. It is positioned for system designs that must consolidate complex logic, memory buffers, and multi-channel I/O into a single programmable device while meeting industrial temperature requirements.

Manufactured by Intel as part of the Stratix V family, this FPGA is suitable for designers looking for scalable logic resources and well-documented device specifications to guide power, thermal, and package-level planning throughout development and production.

Request a quote or submit your project requirements to receive pricing and availability information for the 5SGSMD6K3F40I3G.

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