5SGSMD6K3F40I3G
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 537 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSMD6K3F40I3G – Stratix® V GS FPGA, 583,000 logic elements, ~46 Mbits RAM, 696 I/Os, 1517-BBGA
The 5SGSMD6K3F40I3G is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel. It provides high on-chip logic capacity and embedded memory in a 1517-ball FCBGA package for surface-mount board designs.
With 583,000 logic elements, approximately 46 Mbits of embedded RAM, and 696 I/Os, this industrial-grade device targets complex designs that require large logic capacity, substantial on-chip memory, and extensive I/O connectivity while operating across an industrial temperature range.
Key Features
- Core Density 583,000 logic elements (logic cells) for high-capacity logic integration and complex programmable functions.
- On-chip Memory Approximately 46 Mbits of total RAM bits to support large buffering, state machines, and on-chip data storage.
- I/O Count 696 available I/Os to support wide peripheral, interface, and system-level connectivity without external multiplexing.
- Power Supply Core voltage supply range of 820 mV to 880 mV for core power planning and regulator selection.
- Package & Mounting 1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for dense PCB implementations.
- Temperature & Grade Industrial grade operation with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.
Unique Advantages
- High logic capacity: 583,000 logic elements enable integration of complex digital functions and large custom logic blocks on a single device.
- Substantial embedded memory: Approximately 46 Mbits of on-chip RAM reduce reliance on external memory for many buffering and storage tasks.
- Extensive I/O resources: 696 I/Os provide flexibility for multi-protocol interfaces, sensor arrays, and parallel data paths.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in industrial and temperature-challenging applications.
- Compact FCBGA footprint: 1517-ball FCBGA (40×40) package supports high-density PCB layouts while maintaining robust solderable mounting.
- Low-voltage core operation: 820–880 mV core range enables efficient core power design and fine-grained supply management.
Why Choose 5SGSMD6K3F40I3G?
The 5SGSMD6K3F40I3G combines high logic density, significant embedded memory, and a large I/O count in an industrial-grade Stratix V GS FPGA. It is positioned for system designs that must consolidate complex logic, memory buffers, and multi-channel I/O into a single programmable device while meeting industrial temperature requirements.
Manufactured by Intel as part of the Stratix V family, this FPGA is suitable for designers looking for scalable logic resources and well-documented device specifications to guide power, thermal, and package-level planning throughout development and production.
Request a quote or submit your project requirements to receive pricing and availability information for the 5SGSMD6K3F40I3G.

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