5SGSMD6K3F40C3N
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 915 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSMD6K3F40C3N – Stratix® V GS Field Programmable Gate Array (FPGA) IC
The 5SGSMD6K3F40C3N is a Stratix V GS family Field Programmable Gate Array (FPGA) IC designed for high-density, programmable digital logic applications. This device integrates a large logic fabric with substantial on-chip memory and extensive I/O capacity to support complex system designs.
Engineered for commercial-grade deployments, the device provides a combination of high logic capacity, embedded memory, and wide I/O count while offering documented electrical and switching characteristics in the available Stratix V device datasheet.
Key Features
- High Logic Capacity — 583,000 logic elements (cells) to implement large-scale digital logic and complex FPGA designs.
- Embedded Memory — Approximately 46 Mbits of on-chip RAM to support buffering, large state machines, and memory-hungry algorithms without external memory in many use cases.
- Extensive I/O — 696 user I/O pins to accommodate high pin-count interfaces and multi-channel connectivity.
- Power Supply Range — Core voltage specified between 820 mV and 880 mV to match system power-rail planning and power budgeting.
- Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for commercial-environment applications.
- Package and Mounting — Surface-mount 1517-BBGA FCBGA package (1517-FBGA, 40 × 40) for high-density PCB integration.
- Standards and Documentation — RoHS compliant; the Stratix V device datasheet provides electrical and switching characteristics including transceiver specifications, core/periphery performance, and detailed I/O timing.
Typical Applications
- High-density digital designs — Large logic capacity and abundant embedded RAM make this device suitable for complex processing pipelines and custom compute accelerators.
- High-pin-count interface systems — With 696 I/O pins, the FPGA supports designs that require many parallel interfaces or multiple aggregated channels.
- Memory-intensive algorithms — Approximately 46 Mbits of on-chip RAM supports buffering, FIFOs, and stateful processing without immediate dependence on external memory.
- Platform development and prototyping — Comprehensive datasheet coverage of electrical and switching characteristics aids hardware validation and system integration for development projects.
Unique Advantages
- Large programmable fabric: 583,000 logic elements let designers consolidate complex functions into a single device, reducing board-level complexity.
- Substantial on-chip memory: Approximately 46 Mbits of embedded RAM enables local data storage and high-throughput buffering to optimize performance.
- High I/O density: 696 I/Os support multi-channel interfaces and flexible pin assignments for diverse connectivity needs.
- Commercial-ready thermal profile: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
- Compact surface-mount packaging: 1517-BBGA (1517-FBGA, 40 × 40) delivers high pin count in a compact footprint suitable for dense system boards.
- Documented electrical and timing characteristics: The Stratix V datasheet includes detailed core, periphery, transceiver, and I/O timing data to support engineering integration and validation.
Why Choose 5SGSMD6K3F40C3N?
The 5SGSMD6K3F40C3N is positioned for commercial designs that require a high degree of integration: a large number of logic elements, significant embedded memory, and a very high I/O count in a compact BGA package. It suits engineering teams building dense digital systems, memory-intensive functions, or multi-interface platforms where consolidating functionality into a single FPGA can reduce BOM and simplify board design.
Backed by the Stratix V family documentation, this device offers the electrical and switching details engineers need for system-level power, timing, and signal integrity planning, helping shorten development cycles and improve design confidence.
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