5SGSMD6K3F40C2NCV
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,210 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSMD6K3F40C2NCV – Stratix V GS FPGA, 583,000 logic elements, 696 I/Os
The 5SGSMD6K3F40C2NCV is a Stratix® V GS Field Programmable Gate Array (FPGA) in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package. It delivers substantial on-chip resources—583,000 logic elements and approximately 46.08 Mbits of embedded memory—along with 696 user I/Os and a low-voltage core supply range of 870 mV to 930 mV.
Built for commercial-temperature applications, this device provides a combination of logic capacity, high I/O density, and on-chip RAM suitable for complex digital designs that require significant programmable logic and memory in a compact BGA footprint.
Key Features
- Core Logic 583,000 logic elements (logic cells) to implement large-scale programmable designs and complex hardware functions.
- Embedded Memory Approximately 46.08 Mbits of on-chip RAM for buffering, lookup tables, and state storage within the FPGA fabric.
- I/O Density 696 user I/Os to support wide buses, multiple interfaces, and high-pin-count peripherals directly from the FPGA.
- Power & Voltage Core voltage supply range of 870 mV to 930 mV for the device core; designed for low-voltage FPGA operation.
- Package & Mounting 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40); surface-mount mounting for high-density board designs.
- Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Regulatory Compliance RoHS compliant for restriction of hazardous substances.
Typical Applications
- High-density digital systems — Large logic capacity and abundant embedded memory enable complex state machines, protocol handling, and custom compute pipelines.
- Interface aggregation and bridging — Extensive I/O count supports wide parallel interfaces and multiple peripheral connections on a single device.
- Embedded buffering and packet handling — Approximately 46 Mbits of on-chip RAM can be used for FIFOs, packet buffers, and lookup tables in data-path designs.
Unique Advantages
- Substantial logic resources: 583,000 logic elements provide the capacity to consolidate multiple system functions into a single FPGA package, reducing board-level complexity.
- Large on-chip memory: Approximately 46.08 Mbits of embedded RAM offers significant local storage for buffering and stateful processing without external memory.
- High I/O count: 696 I/Os let designers route numerous interfaces directly to the FPGA, simplifying system integration and I/O management.
- Compact BGA footprint: 1517-BBGA (1517-FBGA, 40×40) provides high pin density in a surface-mount package suited for space-constrained PCBs.
- Commercial-temperature qualification: Rated for 0 °C to 85 °C operation to match a wide range of commercial applications and environments.
- RoHS compliant: Meets environmental substance restrictions for global commercial product deployment.
Why Choose 5SGSMD6K3F40C2NCV?
This Stratix V GS FPGA balances a high logic cell count, substantial embedded memory, and large I/O capacity in a compact 1517-BBGA package, making it well suited for commercial designs that require concentrated programmable resources on a single device. Its low-voltage core operation and surface-mount BGA packaging enable efficient board-level integration for complex digital systems.
Choose this device when your design requires large on-chip logic and memory, dense I/O capability, and commercial-temperature operation with RoHS compliance—delivering scalability and consolidation potential for demanding programmable logic applications.
Request a quote or submit an inquiry to receive pricing, lead-time, and availability information for part number 5SGSMD6K3F40C2NCV.

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