5SGSMD6K3F40C3NCV

The 5SGSMD6K3F40C3NCV is a Stratix® V GS field programmable gate array (FPGA) IC from Intel. It delivers a high logic capacity FPGA fabric with a large on-chip memory footprint and a high I/O count in a compact FCBGA package.

Engineered for designs that require substantial logic resources, abundant embedded RAM, and broad I/O connectivity, this commercial-grade device targets pro-level digital systems where integration and scalable logic density are primary requirements.

Key Features

• Logic Capacity  583,000 logic elements (LEs) to implement complex digital designs and large-scale logic functions.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for data buffering, FIFOs, and large working memory requirements.
• I/O Density  696 user I/O pins to support wide parallel interfaces, large bus widths, and extensive peripheral connectivity.
• Power and Supply  Core voltage supply range of 820 mV to 880 mV to match system power-rail planning and core power budgeting.
• Package and Mounting  1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) with surface-mount mounting for high-density board integration.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature to meet commercial application environment requirements.
• Standards Compliance  RoHS compliant to align with environmental and manufacturing requirements.

Typical Applications

• High-density digital systems  Use where large logic capacity and plentiful embedded RAM are needed to implement complex control, processing, or custom acceleration functions.
• Multi-channel I/O designs  Suitable for systems that require many parallel interfaces or broad bus connectivity thanks to the device’s 696 I/O pins.
• Prototyping and system integration  Ideal for designers consolidating multiple functions into a single FPGA to reduce board-level component count and simplify interconnect.

Unique Advantages

• High logic integration: 583,000 logic elements provide the headroom to implement large, feature-rich designs without partitioning across multiple devices.
• Substantial embedded memory: Approximately 46 Mbits of RAM enables on-chip storage for buffering, lookup tables, and data processing without external memory for many workloads.
• Extensive I/O connectivity: 696 I/Os allow direct interfacing to a wide array of peripherals and parallel buses, reducing the need for external multiplexers or expanders.
• Compact, production-ready package: The 1517-BBGA FCBGA (1517-FBGA supplier package) supports high-density PCB layouts and surface-mount assembly flows.
• Commercial operating range: 0 °C to 85 °C rating aligns with standard commercial electronics deployment scenarios.
• RoHS compliance: Environmentally compliant manufacturing and supply chain compatibility.

Why Choose 5SGSMD6K3F40C3NCV?

The 5SGSMD6K3F40C3NCV offers a strong balance of logic density, embedded memory, and I/O capacity in a single commercial-grade Stratix V GS FPGA. Its specifications make it suitable for teams consolidating complex functions onto one device to simplify boards and accelerate development.

Backed by Stratix V device documentation and Intel’s product support resources, this FPGA fits designs that prioritize integration, scalability, and a high count of system interfaces while meeting standard commercial operating conditions.

Request a quote or submit an inquiry to check availability and pricing for the 5SGSMD6K3F40C3NCV and to discuss how it can meet your project requirements.