5SGSMD6K3F40C2N

The 5SGSMD6K3F40C2N is a Stratix® V GS family field programmable gate array (FPGA) from Intel, offered in a 1517-FBGA (40×40) FCBGA package for surface-mount applications. With approximately 583,000 logic elements and roughly 46 Mbits of embedded memory, this commercial-grade device targets high-density, memory-rich digital designs that require large I/O capacity and strong logic resources.

Designed for commercial temperature operation, the part supports a core supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C, making it suitable for complex system and board-level implementations that demand significant on-chip logic and memory integration.

Key Features

• Core Logic  Approximately 583,000 logic elements to implement complex digital functions and large-scale programmable logic.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, data storage, and memory-intensive algorithms.
• I/O Density  696 user I/O pins to support extensive peripheral interfaces and board-level connectivity.
• Package & Mounting  1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) with surface-mount mounting for compact, board-level integration.
• Power  Core voltage supply specified from 870 mV to 930 mV to align with Stratix V family operating requirements.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental  RoHS compliant.

Typical Applications

• High-density signal processing: Use the large logic element count and substantial embedded memory to implement DSP pipelines, packet buffering, and real-time data manipulation.
• Multi-I/O system bridging: Leverage 696 I/O pins to interface and consolidate multiple peripherals, protocols, or board subsystems on a single FPGA.
• Prototyping and complex digital design: Deploy the Stratix V GS device for large-scale prototype SoC implementations that require significant programmable logic and on-chip RAM.
• Memory-intensive acceleration: Utilize the approximately 46 Mbits of embedded RAM for algorithm acceleration, lookup tables, and intermediate storage within compute pipelines.

Unique Advantages

• High logic density: Approximately 583,000 logic elements provide the capacity to consolidate complex functions into a single device, reducing system BOM.
• Significant on-chip memory: Approximately 46 Mbits of embedded RAM minimizes external memory requirements for many applications, improving performance and board simplicity.
• Extensive I/O resources: 696 I/O pins enable broad connectivity and flexible interfacing options without external multiplexing.
• Compact FCBGA footprint: The 1517-FBGA (40×40) package allows high-density integration on modern PCBs while supporting surface-mount assembly.
• Commercial-grade operation: Rated for 0 °C to 85 °C, matching typical commercial deployment environments.
• RoHS compliant: Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose 5SGSMD6K3F40C2N?

The 5SGSMD6K3F40C2N positions itself as a high-density Stratix V GS FPGA option for designs requiring substantial programmable logic, large on-chip memory, and broad I/O capability in a compact FCBGA package. Its commercial-grade rating and defined core voltage range make it appropriate for board-level integration where high logic capacity and embedded memory are priorities.

Engineers and procurement teams pursuing consolidated, memory-rich programmable solutions will find this device suitable for complex digital systems, prototyping, and applications that benefit from many I/Os and a compact ball-grid footprint, supported by Intel's Stratix V device documentation.

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