5SGSMD6N1F45C2LG

The 5SGSMD6N1F45C2LG is a Stratix® V GS field programmable gate array (FPGA) from Intel, delivered in a 1932-ball FCBGA package for surface-mount applications. It provides a high-density programmable logic fabric combined with substantial on‑chip memory and a large I/O count for advanced system designs.

Targeted at commercial-grade deployments, this device is suitable for designs that require abundant logic resources, significant embedded RAM, and extensive external interfacing within a single, compact package.

Key Features

• Logic Capacity  Approximately 583,000 logic elements to implement complex, high‑density digital logic and custom datapaths.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM to support buffering, FIFOs, and memory-intensive algorithms without external memory for many functions.
• High I/O Count  840 user I/O pins enable broad external connectivity for parallel interfaces, multi‑lane buses, or large sensor and actuator arrays.
• Core Voltage  Core supply range is 820 mV to 880 mV, as specified for device operation.
• Package & Mounting  1932‑BBGA FCBGA (supplier device package listed as 1932‑FBGA, FC 45×45) in a surface‑mount form factor for compact board integration.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for commercial applications.
• Programmable I/O Timing  Device documentation covers I/O timing features including programmable I/O element (IOE) delay and programmable output buffer delay for timing tuning.
• Compliance  RoHS‑compliant material composition.

Typical Applications

• High-density logic implementations  Use the device where large amounts of programmable logic and on‑chip memory are required to implement complex state machines, custom accelerators, or layered processing pipelines.
• Data interfacing and aggregation  The 840 I/O pins make this FPGA suitable for designs that consolidate multiple parallel interfaces or require extensive sensor and peripheral connectivity.
• Embedded system prototyping  Leverage the device’s logic capacity and embedded RAM for validating large digital subsystems and accelerating system bring‑up in commercial projects.

Unique Advantages

• Large programmable fabric: 583,000 logic elements provide headroom for complex logic integration and multi‑function designs, reducing the need for multiple devices.
• Substantial on‑chip memory: Approximately 46 Mbits of embedded RAM minimizes dependence on external memory for many buffering and data‑processing tasks.
• Extensive I/O connectivity: 840 I/Os support dense external interfacing and simplify board‑level routing for high‑pin‑count systems.
• Compact FCBGA package: 1932‑ball FCBGA in a surface‑mount footprint enables high integration density on compact PCBs.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns the device with a wide range of commercial applications.
• Standards‑oriented documentation: Electrical and switching characteristics, I/O timing, and power information are documented in the Stratix V device datasheet to support design verification.

Why Choose 5SGSMD6N1F45C2LG?

The 5SGSMD6N1F45C2LG delivers a combination of high logic density, large embedded memory, and a very high I/O count in a compact FCBGA package, making it well suited for commercial designs that consolidate complex digital functions and extensive external interfaces. Its documented electrical and I/O timing characteristics provide the specification detail engineers need for integration and system validation.

This Stratix V GS device is positioned for customers who require scalable programmable resources and on‑chip memory capacity while maintaining a commercial temperature profile and surface‑mount packaging for compact board designs.

Request a quote or submit an inquiry to learn more about availability and ordering for the 5SGSMD6N1F45C2LG.