5SGSMD6N1F45I2G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA

Quantity 646 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSMD6N1F45I2G – Stratix® V GS FPGA, 1932-BBGA (FCBGA)

The 5SGSMD6N1F45I2G is an Intel Stratix V GS field-programmable gate array (FPGA) supplied in a 1932-ball FCBGA package. It provides large on-chip logic capacity, significant embedded memory, and a high pin count for designs that require extensive I/O and integration.

Targeted for industrial-grade deployments, this device combines approximately 583,000 logic elements with about 46.08 Mbits of embedded memory and 840 user I/O, enabling complex digital processing, transceiver-based interfaces, and dense system integration within a surface-mount 45×45 mm supplier package.

Key Features

  • Logic Capacity  Approximately 583,000 logic elements for implementing large-scale digital designs.
  • Logic Array Blocks (LABs)  220,000 logic array blocks (LABs) to structure logic resources across the device.
  • Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for data buffering, FIFOs, and local storage.
  • I/O  840 user I/O pins to support extensive peripheral interfacing and board-level connectivity.
  • Package  1932-ball BGA, FCBGA; supplier device package listed as 1932-FBGA, FC (45×45 mm) for high-density board integration.
  • Mounting  Surface-mount package suitable for modern PCB assembly processes.
  • Voltage Supply  Core voltage range specified at 870 mV to 930 mV for device operation.
  • Temperature Grade  Industrial grade with operating temperature range of −40 °C to 100 °C.
  • Stratix V Series Electrical Reference  Device characteristics and switching behavior are documented in the Stratix V device datasheet, which covers operating conditions, power, and I/O timing for the family.

Typical Applications

  • High-density digital processing  Large logic capacity and embedded RAM for signal processing pipelines, algorithm acceleration, and complex state machines.
  • Transceiver and high-speed interfaces  Stratix V GS family device characteristics support designs requiring serial transceivers and programmable I/O timing.
  • Industrial control and automation  Industrial temperature rating and extensive I/O make the device suitable for demanding control, monitoring, and automation systems.
  • Board-level integration and prototyping  High I/O count and a compact 1932-ball FCBGA package facilitate integration into dense PCB layouts and multi-function modules.

Unique Advantages

  • Substantial on-chip resources:  Combining approximately 583,000 logic elements with ~46.08 Mbits of embedded memory reduces the need for external logic and RAM, simplifying system BOM and routing.
  • High I/O density:  840 user I/O enable multiple parallel interfaces and flexible board-level connectivity without external expanders.
  • Industrial temperature range:  Rated for −40 °C to 100 °C operation to meet industrial environment requirements.
  • Compact, high-density package:  1932-ball FCBGA (45×45 mm) allows dense, surface-mount integration for space-constrained PCBs.
  • Documented Stratix V characteristics:  Electrical and switching parameters for the Stratix V family are available in the vendor device datasheet to support system-level design and validation.

Why Choose 5SGSMD6N1F45I2G?

The 5SGSMD6N1F45I2G positions itself as an industrial-grade Stratix V GS FPGA option for designs that require extensive logic, significant embedded memory, and a high count of user I/O in a compact FCBGA package. Its specified core voltage range and documented Stratix V electrical characteristics make it suitable for engineered systems where predictable device behavior and detailed design data are required.

Ideal for engineering teams building complex digital processing, transceiver-enabled interfaces, or tightly integrated industrial systems, this Intel Stratix V device delivers on-chip resources and form-factor density that help reduce external components and simplify board-level design choices.

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