5SGSMD8K1F40C2LN

The 5SGSMD8K1F40C2LN is an Intel Stratix V GS-series FPGA supplied in a 1517-ball FCBGA (40×40) package for surface-mount assembly. It provides a very high logic capacity with 695,000 logic elements and approximately 51.2 Mbits of embedded RAM, plus 696 user I/Os for dense, multi‑interface designs.

Rated for commercial operation (0 °C to 85 °C) and a core supply range of 820 mV to 880 mV, this device targets applications that require large programmable logic fabric, abundant on-chip memory, and extensive I/O connectivity in a compact BGA footprint.

Key Features

• High-density logic — 695,000 logic elements provide substantial programmable fabric for complex digital functions and custom accelerators.
• Embedded memory — Total on-chip RAM of 51,200,000 bits (approximately 51.2 Mbits) for large buffering, lookup tables, and data storage without external memory.
• Extensive I/O — 696 I/O pins support broad peripheral interfacing and multi-channel system integration.
• Power domain — Core supply voltage specified from 820 mV to 880 mV to align with system power budgets and core voltage rails.
• Package & mounting — 1517-BBGA (FBGA 40×40) package in a surface-mount form factor for compact board layouts.
• Commercial grade — Rated for 0 °C to 85 °C operation for commercial electronics applications.

Typical Applications

• High-density programmable logic — Implement large-scale digital designs and custom processing blocks using 695,000 logic elements and substantial on-chip RAM.
• Multi-interface systems — Leverage 696 I/Os to connect to numerous peripherals, front-end devices, or system buses in a single device.
• Compact board designs — The 1517-FBGA (40×40) package enables high‑capacity FPGA integration where board area and routing density are constrained.
• Commercial electronic products — Suitable for commercial-grade deployments that operate within 0 °C to 85 °C temperature range and standard supply environments.

Unique Advantages

• Highly integrated logic and memory: Combining 695,000 logic elements with ~51.2 Mbits of on-chip RAM reduces reliance on external components for many designs.
• Large I/O capacity: 696 I/Os simplify system-level integration and reduce the need for external multiplexing or I/O expanders.
• Compact BGA footprint: The 1517-ball FCBGA package supports high-density board layouts while maintaining a surface-mount assembly process.
• Defined commercial operating range: Specified 0 °C to 85 °C temperature rating and commercial grade labeling align with mainstream electronics product requirements.
• Controlled core voltage range: 0.82–0.88 V core supply specification enables predictable power planning for the device core.

Why Choose 5SGSMD8K1F40C2LN?

The 5SGSMD8K1F40C2LN delivers substantial programmable resources and on-chip memory in a single compact BGA package, making it well suited for design teams that need to consolidate functionality, reduce external parts, and support dense I/O requirements. Its commercial temperature rating and specified core voltage range provide clear parameters for system power and thermal planning.

Engineers building complex digital systems, multi-interface controllers, or compact FPGA-based solutions will find the device’s combination of logic capacity, embedded RAM, and extensive I/O beneficial for scalable designs that demand high integration within a surface-mount BGA form factor.

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