5SGSMD6N3F45I4G
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 807 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSMD6N3F45I4G – Stratix V GS FPGA, 583,000 Logic Elements, 840 I/Os
The 5SGSMD6N3F45I4G is a Stratix® V GS field programmable gate array (FPGA) in a 1932-BBGA FCBGA package designed for industrial-grade system designs. It integrates a high logic capacity and substantial on-chip memory with a large I/O count to support complex, high-density digital designs that require extensive routing and embedded resources.
As a member of the Stratix V family, this device is specified with industrial temperature grading and electrical characteristics documented in the Stratix V device datasheet, making it suitable for designs that must operate across a broad temperature range while providing a high level of integration.
Key Features
- Logic Capacity Approximately 583,000 logic elements and about 220,000 CLBs, providing large-scale programmable logic for complex functions and integration of multiple subsystems on a single IC.
- Embedded Memory Approximately 46 Mbits of on-chip RAM, enabling sizable buffering, lookup tables, and state storage without external memory in many designs.
- I/O Density 840 user I/Os, supporting extensive external interfacing and parallel connectivity for multi-channel systems or high-pin-count board designs.
- Package & Mounting 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type for standard PCB assembly processes.
- Power Supply Range Core supply specified from 820 mV to 880 mV, enabling precise core-voltage planning in power delivery design.
- Operating Temperature Industrial temperature range of −40 °C to 100 °C for deployment in thermally demanding environments.
- Compliance RoHS compliant.
Typical Applications
- High-density logic integration Use where a large number of logic elements and CLBs are required to consolidate multiple digital functions into a single FPGA.
- Memory-intensive implementations Designs that need substantial on-chip RAM for buffering, data processing, or lookup operations can leverage approximately 46 Mbits of embedded memory.
- High-I/O systems Applications that require numerous external interfaces or parallel channel support can benefit from the device’s 840 I/Os.
- Industrial equipment Systems that demand operation across −40 °C to 100 °C can utilize this industrial-grade FPGA for reliable performance in challenging temperature conditions.
Unique Advantages
- Large programmable resource pool: The combination of ~583,000 logic elements and ~220,000 CLBs allows architects to map complex algorithms and multiple subsystems into a single device, reducing board-level complexity.
- Substantial embedded memory: Approximately 46 Mbits of on-chip RAM reduces dependency on external memory for many buffering and data-path tasks, simplifying system BOM and layout.
- High I/O count: 840 I/Os enable flexible interfacing with peripherals, sensors, and high-channel-count front-ends without additional expansion devices.
- Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in industrial and thermally variable environments.
- Compact, surface-mount FCBGA packaging: The 1932-BBGA (1932-FBGA, FC 45×45) package provides a high pin density in a package suitable for modern PCB assembly processes.
- Regulatory readiness: RoHS compliance aligns the device with common environmental and manufacturing directives.
Why Choose 5SGSMD6N3F45I4G?
The 5SGSMD6N3F45I4G delivers a high level of integration by combining large-scale programmable logic, substantial embedded memory, and a very high I/O count in an industrial-temperature FPGA package. These attributes make it suitable for engineers designing complex digital systems that require consolidated resources, significant local memory, and extensive external connectivity.
Choosing this Stratix V GS device supports scalability and robustness in applications where on-chip capacity and operating-range stability are priorities, while RoHS compliance and standard surface-mount packaging simplify manufacturing and supply-chain considerations.
Request a quote or submit an inquiry to get pricing and availability information for the 5SGSMD6N3F45I4G and to discuss volume, lead time, or technical qualification needs.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018