5SGSMD6N3F45I4G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA

Quantity 807 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSMD6N3F45I4G – Stratix V GS FPGA, 583,000 Logic Elements, 840 I/Os

The 5SGSMD6N3F45I4G is a Stratix® V GS field programmable gate array (FPGA) in a 1932-BBGA FCBGA package designed for industrial-grade system designs. It integrates a high logic capacity and substantial on-chip memory with a large I/O count to support complex, high-density digital designs that require extensive routing and embedded resources.

As a member of the Stratix V family, this device is specified with industrial temperature grading and electrical characteristics documented in the Stratix V device datasheet, making it suitable for designs that must operate across a broad temperature range while providing a high level of integration.

Key Features

  • Logic Capacity  Approximately 583,000 logic elements and about 220,000 CLBs, providing large-scale programmable logic for complex functions and integration of multiple subsystems on a single IC.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM, enabling sizable buffering, lookup tables, and state storage without external memory in many designs.
  • I/O Density  840 user I/Os, supporting extensive external interfacing and parallel connectivity for multi-channel systems or high-pin-count board designs.
  • Package & Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type for standard PCB assembly processes.
  • Power Supply Range  Core supply specified from 820 mV to 880 mV, enabling precise core-voltage planning in power delivery design.
  • Operating Temperature  Industrial temperature range of −40 °C to 100 °C for deployment in thermally demanding environments.
  • Compliance  RoHS compliant.

Typical Applications

  • High-density logic integration  Use where a large number of logic elements and CLBs are required to consolidate multiple digital functions into a single FPGA.
  • Memory-intensive implementations  Designs that need substantial on-chip RAM for buffering, data processing, or lookup operations can leverage approximately 46 Mbits of embedded memory.
  • High-I/O systems  Applications that require numerous external interfaces or parallel channel support can benefit from the device’s 840 I/Os.
  • Industrial equipment  Systems that demand operation across −40 °C to 100 °C can utilize this industrial-grade FPGA for reliable performance in challenging temperature conditions.

Unique Advantages

  • Large programmable resource pool: The combination of ~583,000 logic elements and ~220,000 CLBs allows architects to map complex algorithms and multiple subsystems into a single device, reducing board-level complexity.
  • Substantial embedded memory: Approximately 46 Mbits of on-chip RAM reduces dependency on external memory for many buffering and data-path tasks, simplifying system BOM and layout.
  • High I/O count: 840 I/Os enable flexible interfacing with peripherals, sensors, and high-channel-count front-ends without additional expansion devices.
  • Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in industrial and thermally variable environments.
  • Compact, surface-mount FCBGA packaging: The 1932-BBGA (1932-FBGA, FC 45×45) package provides a high pin density in a package suitable for modern PCB assembly processes.
  • Regulatory readiness: RoHS compliance aligns the device with common environmental and manufacturing directives.

Why Choose 5SGSMD6N3F45I4G?

The 5SGSMD6N3F45I4G delivers a high level of integration by combining large-scale programmable logic, substantial embedded memory, and a very high I/O count in an industrial-temperature FPGA package. These attributes make it suitable for engineers designing complex digital systems that require consolidated resources, significant local memory, and extensive external connectivity.

Choosing this Stratix V GS device supports scalability and robustness in applications where on-chip capacity and operating-range stability are priorities, while RoHS compliance and standard surface-mount packaging simplify manufacturing and supply-chain considerations.

Request a quote or submit an inquiry to get pricing and availability information for the 5SGSMD6N3F45I4G and to discuss volume, lead time, or technical qualification needs.

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