5SGSMD6N3F45I3LN

The 5SGSMD6N3F45I3LN is an Intel Stratix® V GS field programmable gate array in a 1932-BBGA (FCBGA) package, delivered as a surface-mount device and RoHS compliant. It provides a high-density programmable fabric with 583,000 logic elements and approximately 46 Mbits of embedded memory, and exposes up to 840 I/O pins for complex system integration.

Rated for industrial operation from –40 °C to 100 °C and a core supply range of 820 mV to 880 mV, this device is targeted at applications that require substantial on-chip logic and memory resources combined with large I/O capacity and robust thermal range.

Key Features

• Logic Capacity  Provides 583,000 logic elements for implementing large-scale programmable logic and custom accelerators.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive functions without external RAM.
• I/O Density  Up to 840 I/O pins to accommodate wide parallel interfaces, multi-channel I/O, and board-level connectivity.
• Package & Mounting  Packaged in a 1932-BBGA (FCBGA) format; supplier package referenced as 1932-FBGA, FC (45×45), and intended for surface-mount assembly.
• Industrial Temperature Grade  Specified operating range from –40 °C to 100 °C suitable for industrial environments.
• Core Voltage  Core supply voltage range of 820 mV to 880 mV for system power budgeting and supply planning.
• Regulatory  RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• High-density I/O systems  Systems that require many parallel or multi-channel interfaces can leverage the device’s up to 840 I/O pins for broad connectivity.
• Memory-intensive logic  Designs that need substantial on-chip buffering or embedded data storage can use the device’s approximately 46 Mbits of RAM to reduce external memory dependencies.
• Large-scale programmable logic  Applications requiring hundreds of thousands of logic elements for complex algorithms, signal processing, or custom accelerators.
• Industrial control and automation  Deployments requiring an industrial temperature range (–40 °C to 100 °C) and high integration density.

Unique Advantages

• High on-chip integration: 583,000 logic elements and approximately 46 Mbits of embedded memory reduce the need for external components and simplify BOM.
• Extensive I/O support: Up to 840 I/O pins enable complex multi-channel interfaces and flexible board-level connectivity.
• Industrial-rated operation: Rated from –40 °C to 100 °C for reliable performance across demanding environmental conditions.
• Compact, surface-mount package: 1932-BBGA (FCBGA) packaging in a 45×45 supplier footprint supports dense board layouts and high pin count routing.
• Low-voltage core: 820 mV to 880 mV core supply range supports modern low-voltage power architectures.
• RoHS compliant: Meets lead-free manufacturing requirements for environmentally conscious production.

Why Choose 5SGSMD6N3F45I3LN?

The 5SGSMD6N3F45I3LN positions itself as a high‑density Stratix® V GS FPGA that balances large programmable logic capacity, substantial on‑chip RAM, and broad I/O availability in a single industrial-grade package. Its combination of 583,000 logic elements, approximately 46 Mbits of embedded memory, and up to 840 I/Os makes it suitable for designs that require heavy on-chip processing, wide interfacing, and robust thermal range.

Built by Intel and delivered in a compact 1932-BBGA surface-mount package, this device is a practical choice for engineering teams targeting scalable, high‑integration FPGA solutions where board-level consolidation, industrial temperature operation, and RoHS compliance are priorities.

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