5SGSMD6N3F45C4N

The 5SGSMD6N3F45C4N is a Stratix V GS family FPGA from Intel, offering a high-density programmable fabric with a large I/O count and substantial on-chip RAM. This device targets designs that require extensive logic resources, abundant I/O, and embedded memory within a compact FCBGA package.

With approximately 583,000 logic elements and roughly 46 Mbits of embedded memory, the device is well suited for systems that consolidate complex digital logic and large buffering or state storage while operating within a commercial temperature range.

Key Features

• Logic Capacity  Approximately 583,000 logic elements for large-scale programmable logic integration.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, FIFOs, and state storage.
• I/O Density  840 user I/Os to support high-pin-count peripheral integration and multi-interface designs.
• Package & Mounting  1932-ball BGA (FCBGA) supplier package (1932-FBGA, FC, 45×45) in a surface-mount footprint for high-density board integration.
• Power Supply  Core supply operating range from 820 mV to 880 mV to match targeted power domains.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS‑compliant for lead-free manufacturing requirements.

Typical Applications

• High-density logic consolidation  Use the device to integrate extensive custom digital logic where large numbers of logic elements are required.
• Large-buffering and packet memory  Embedded RAM supports designs needing on-chip buffering or intermediate storage for data streams.
• Multi-interface bridging  High I/O count enables bridging between numerous peripherals and sub-systems on a single FPGA.
• Compact, high-pin-count systems  The 1932-BBGA (FCBGA) package enables dense board-level implementations where area and pin count are critical.

Unique Advantages

• High logic density: Approximately 583k logic elements allow large designs or multiple subsystems to be instantiated on a single device, reducing BOM and system complexity.
• Substantial on-chip RAM: Around 46 Mbits of embedded memory minimizes dependence on external memory for buffering and state retention, improving latency and board routing.
• Extensive I/O capacity: 840 I/Os support complex connectivity requirements without multiple interface chips, simplifying system partitioning.
• Compact FCBGA packaging: The 1932-ball FCBGA package concentrates pins and silicon area into a small footprint suitable for space-constrained boards.
• Low-voltage core operation: 820–880 mV core supply range enables integration with low-voltage power architectures.
• RoHS compliant: Meets lead‑free process requirements for modern electronics manufacturing.

Why Choose 5SGSMD6N3F45C4N?

The 5SGSMD6N3F45C4N provides a combination of high logic capacity, significant embedded memory, and a large I/O count in a compact FCBGA package—making it suited to designs that consolidate multiple digital functions onto a single FPGA. Its commercial temperature rating and low-voltage core operation align with modern board-level power architectures and manufacturing processes.

Designed as part of the Stratix V family, this device is appropriate for projects that prioritize integration density and on-chip resources while maintaining compliance with RoHS manufacturing practices. It is a practical choice for engineers and procurement teams specifying a high-capacity FPGA for complex digital systems.

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