5SGSMD6N3F45C3G

The 5SGSMD6N3F45C3G is a Stratix V GS Field Programmable Gate Array (FPGA) offered in a 1932-BBGA FCBGA package. It delivers very high on-chip logic and memory resources together with a large I/O count for dense digital designs.

With approximately 583,000 logic elements and approximately 46 Mbits of embedded memory, this commercial-grade FPGA is suited to designs that require substantial programmable logic, abundant embedded RAM, and extensive external connectivity while operating within a 0 °C to 85 °C temperature range.

Key Features

• Core Logic  Approximately 583,000 logic elements to support large-scale, high-density logic implementations.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
• I/O Capacity  840 general-purpose I/O pins to enable wide-ranging external interfacing and high pin-count designs.
• Package & Mounting  1932-BBGA (supplier package 1932-FBGA, FC 45×45) in a surface-mount BGA format for compact board integration.
• Power  Voltage supply range of 820 mV to 880 mV for core operation.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• I/O Timing & Switching  Device datasheet documents I/O timing, including programmable I/O element (IOE) delay and programmable output buffer delay, and switching characteristics.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Use the large logic element and memory resources for complex state machines, datapaths, and custom accelerators.
• Memory-intensive functions  Leverage approximately 46 Mbits of embedded RAM for buffering, packet processing, and on-chip data staging.
• High I/O connectivity  840 I/Os support designs that require extensive external interfaces, multi-bank peripherals, or dense connector routing.

Unique Advantages

• High logic density: Approximately 583,000 logic elements provide the resources to implement large-scale, integrated digital systems on a single device.
• Significant on-chip RAM: Approximately 46 Mbits of embedded memory reduces external memory dependency for many buffering and storage needs.
• Extensive I/O availability: 840 I/O pins enable complex board-level interfacing without multiple companion devices.
• Compact BGA footprint: 1932-BBGA/1932-FBGA (45×45) package delivers high resource count in a single surface-mount package suitable for dense PCB layouts.
• Low-voltage core operation: Core voltage range of 820 mV–880 mV supports optimized power distribution for the device core.
• Standards-ready supply status: RoHS compliance supports modern manufacturing and regulatory requirements.

Why Choose 5SGSMD6N3F45C3G?

The 5SGSMD6N3F45C3G Stratix V GS FPGA combines very large logic capacity, substantial embedded RAM, and a high I/O count in a single commercial-grade BGA package. It is suited to designs that need to consolidate complex digital functions, reduce BOM count, and provide flexible on-chip memory and interfacing options while operating within a 0 °C to 85 °C range.

For engineering teams building high-density programmable logic solutions, this FPGA delivers a balance of compute resources, memory, and connectivity that supports scalable designs and board-level integration in a RoHS-compliant, surface-mount package.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGSMD6N3F45C3G Stratix V GS FPGA.