5SGSMD6N3F45C4G

The 5SGSMD6N3F45C4G is a Stratix® V GS family FPGA from Intel, supplied in a 1932-BBGA FCBGA package for surface-mount assembly. It delivers high logic density, abundant on-chip RAM, and a large number of I/O for commercial-grade digital designs.

This device targets commercial applications that require extensive programmable logic, significant embedded memory (approximately 46 Mbits), and up to 840 I/O pins, while operating within a 0 °C to 85 °C temperature range and a core supply range of 820 mV to 880 mV.

Key Features

• Logic Capacity — Approximately 583,000 logic elements, with a second reported capacity of 220,000 logic blocks, providing substantial programmable logic resources for complex designs.
• Embedded Memory — Total on-chip RAM of 46,080,000 bits (approximately 46 Mbits) to support memory-intensive functions and buffering requirements.
• High I/O Count — Up to 840 I/O pins to accommodate dense external connectivity and multi-channel interfacing.
• Power and Core Voltage — Core supply voltage specified between 820 mV and 880 mV; suitable for designs matching the Stratix V core-voltage requirements.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for commercial system deployments.
• Package and Mounting — 1932-BBGA (FCBGA) package, supplier device package noted as 1932-FBGA, FC (45×45), designed for surface-mount assembly.
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• High-density digital systems — Use the large logic element count and embedded RAM for complex state machines, custom processing pipelines, and large-scale glue logic.
• Multi-channel I/O aggregation — The 840 I/O pins support designs requiring extensive external interfacing, board-level protocol bridging, or high-pin-count peripheral integration.
• Memory‑intensive buffering and packet handling — Approximately 46 Mbits of on-chip RAM enable on-chip FIFOs, buffering, and local data storage for streaming and packet-processing tasks.

Unique Advantages

• Substantial programmable resources: Large logic element count supports complex algorithms and large parallel designs without immediate migration to external logic chips.
• Significant on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependency on external memory for many buffering and caching needs.
• Very high I/O availability: Up to 840 I/O pins simplify board-level connectivity and multi-interface designs, reducing the need for external multiplexers.
• Commercial-grade deployment: Rated 0 °C to 85 °C for reliable operation in commercial environments and system-level products.
• Compact, manufacturable package: 1932-BBGA (FCBGA) 45×45 package supports high-density PCB layouts and surface-mount assembly processes.
• RoHS compliant: Conforms to RoHS requirements for lead-free manufacturing environments.

Why Choose 5SGSMD6N3F45C4G?

The 5SGSMD6N3F45C4G combines a large pool of programmable logic, substantial embedded memory, and a high I/O count in a commercial-grade Stratix V GS FPGA. It is well suited for designers who need on-chip resources to implement complex logic, extensive interfacing, and memory-backed functions within the 0 °C to 85 °C commercial operating range.

As a member of the Stratix V family from Intel, the device aligns with documented Stratix V electrical and switching characteristics and is appropriate for commercial systems that require a balance of logic capacity, I/O density, and on-chip memory.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and ordering information for the 5SGSMD6N3F45C4G.