5SGSMD6N3F45C2N

The 5SGSMD6N3F45C2N is a Stratix® V GS field programmable gate array (FPGA) packaged in a high-pin-count FCBGA. It provides a large programmable fabric with high I/O capacity and substantial on-chip memory for complex digital designs. Typical use cases include systems that require dense logic consolidation, extensive I/O connectivity, and significant embedded memory resources.

Key Features

• Logic Capacity  583,000 logic elements and approximately 220,000 logic array blocks provide high-density programmable logic for complex function implementation.
• Embedded Memory  Approximately 46 Mbits of total on-chip RAM to support buffering, FIFOs, and lookup tables without external memory.
• I/O Resources  840 user I/Os to support wide parallel interfaces and high-pin-count system integration.
• Power  Core supply voltage specified between 870 mV and 930 mV for the programmable fabric.
• Package & Mounting  1932-BBGA (FCBGA, 45 × 45) package in a surface-mount form factor designed for dense board-level integration.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Use the large logic capacity and embedded RAM to consolidate multiple functions into a single, reconfigurable device.
• Data buffering and packet processing  Leverage the approximately 46 Mbits of on-chip RAM and abundant I/Os for packet buffering, queues, and intermediate storage.
• Multi-I/O interface hubs  The 840 I/Os enable complex board-level interfacing, bridging, and protocol adaptation tasks that need many parallel connections.
• Prototyping and system validation  Dense logic and large I/O count allow rapid hardware prototyping of system-level designs within a commercial temperature envelope.

Unique Advantages

• High logic density: 583,000 logic elements let you implement large, partitioned designs without immediate external decomposition.
• Substantial on-chip RAM: Approximately 46 Mbits of embedded memory reduces dependence on off-chip memory for many buffering and storage tasks.
• Extensive I/O capability: 840 I/Os facilitate broad connectivity for multi-channel and parallel-interface applications, minimizing glue logic.
• High-pin-count FCBGA package: The 1932-BBGA (45 × 45) package supports complex PCB routing and dense system integrations.
• Commercial temperature suitability: Rated for 0 °C to 85 °C to match a wide range of commercial electronic applications.
• RoHS compliant: Environmentally compliant for deployment in lead-free manufacturing flows.

Why Choose 5SGSMD6N3F45C2N?

The 5SGSMD6N3F45C2N combines high logic element count, large embedded memory, and a very high I/O count in a single Stratix V GS FCBGA package, making it suitable for dense, I/O-heavy designs in commercial-temperature applications. Its core voltage range and surface-mount FCBGA packaging support modern board-level integration and power architectures.

This device is well suited to engineers and procurement teams specifying FPGA solutions that require consolidated logic, on-chip buffering, and broad connectivity while maintaining RoHS compliance and commercial-grade operating conditions.

Request a quote or submit an inquiry for pricing and lead-time information to move this FPGA into your BOM and project schedule.