5SGSMD6N3F45C2G

The 5SGSMD6N3F45C2G is a Stratix® V GS Field Programmable Gate Array (FPGA) IC designed for high-density, programmable logic applications. As a member of the Stratix V GS family, it provides a combination of large logic capacity, substantial on-chip memory, and extensive I/O for complex digital designs in commercial-grade systems.

This device targets applications that require large amounts of embedded logic and memory with flexible I/O — enabling advanced packet processing, DSP, protocol bridging, and other compute-intensive functions while operating within a commercial temperature range.

Key Features

• Logic Capacity  Approximately 583,000 logic elements, enabling implementation of large-scale, highly parallel logic designs.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for buffering, FIFOs, and algorithm acceleration without external memory dependence.
• I/O Density  Up to 840 I/O pins to support wide data buses, multiple interfaces, and extensive peripheral connectivity.
• Core Voltage Range  Specified voltage supply between 870 mV and 930 mV to match required core-power rails and support stable operation.
• Package & Mounting  1932‑BBGA (FCBGA) package, supplier device package listed as 1932‑FBGA, FC (45×45); surface-mount package suitable for compact, high-density board layouts.
• Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial deployments.
• Standards Compliance  RoHS compliant, meeting lead-free and restricted-substances requirements for modern electronics manufacturing.

Typical Applications

• High-performance networking  Leverage the device’s large logic count and abundant I/O for packet processing, protocol conversion, and network appliance functions.
• Digital signal processing  On-chip RAM and dense logic enable DSP algorithms, streaming data paths, and real-time signal manipulation.
• Data center acceleration  Use the FPGA’s capacity for custom compute kernels, data-path acceleration, and offload tasks in commercial data-processing equipment.
• Test and measurement  High I/O count and programmable logic support complex acquisition, stimulus generation, and protocol emulation in commercial test systems.

Unique Advantages

• High logic density: Approximately 583,000 logic elements provide headroom for large, multi-function designs and parallel architectures.
• Significant on-chip memory: Approximately 46.08 Mbits of embedded RAM reduces dependence on external memory, lowering BOM and improving latency for buffering and streaming tasks.
• Extensive I/O: 840 I/O pins enable wide parallel interfaces and support for multiple protocol endpoints without external multiplexing.
• Compact, production-ready package: 1932‑BBGA FCBGA in a 45×45 format supports high-density PCB designs while facilitating surface-mount assembly.
• Commercial temperature rating: Engineered for standard commercial environments (0 °C to 85 °C), aligning with typical enterprise and industrial-adjacent deployments.
• Regulatory readiness: RoHS compliance simplifies environmental-conformance requirements in modern electronics manufacturing.

Why Choose 5SGSMD6N3F45C2G?

The 5SGSMD6N3F45C2G balances large-scale programmable logic, substantial embedded memory, and broad I/O in a single commercial-grade Stratix V GS FPGA package. Its specifications make it suitable for teams designing complex, performance-oriented systems that benefit from on-chip resources and high I/O density.

This part is appropriate for engineering and procurement teams focused on scalable, high-capacity FPGA solutions where integration density, memory bandwidth, and I/O count directly influence system architecture and total cost of ownership.

Request a quote or submit an inquiry to purchase the 5SGSMD6N3F45C2G and discuss volume availability, lead times, and technical support for your design requirements.