5SGSMD6N2F45I3LG

The 5SGSMD6N2F45I3LG is a Stratix® V GS series FPGA from Intel, delivered in a high-pin-count FCBGA package. It integrates a large logic fabric and on-chip memory to address complex digital designs requiring extensive I/O and programmable logic capacity.

This industrial-grade device provides detailed electrical operating conditions and switching characteristics defined in the Stratix V device documentation. Key measurable specifications include approximately 583,000 logic elements, roughly 46 Mbits of embedded memory, 840 user I/O pins, and an industrial operating temperature range of –40 °C to 100 °C.

Key Features

• Logic Capacity — The device includes 583,000 logic elements to implement large, compute-intensive logic designs.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM for buffering, look-up tables, and memory-intensive functions.
• High Pin-Count I/O — 840 user I/Os to support broad connectivity and parallel interfaces.
• Package and Mounting — Supplied in a 1932-BBGA FCBGA (supplier package: 1932-FBGA, FC (45×45)) surface-mount package for high-density board integration.
• Voltage Supply — Core supply range specified from 820 mV to 880 mV to match defined system power rails.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Regulatory Compliance — RoHS-compliant construction.

Unique Advantages

• Substantial logic resources: 583,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing system-level component count.
• Large embedded memory: Approximately 46 Mbits of on-chip RAM supports buffering, packet processing, and data staging without immediate external memory dependency.
• Extensive I/O capability: 840 I/Os provide flexibility for diverse bus interfaces, parallel data paths, and dense connector mappings.
• Industrial reliability: Specified operating range to 100 °C and industrial grade marking support designs intended for demanding temperature environments.
• High-density package: The 1932-ball FCBGA (45×45 supplier footprint) balances high signal count with a compact board area for space-constrained applications.
• Predictable core power envelope: Defined core voltage range (820 mV–880 mV) aids in PSU selection and thermal/power planning.

Why Choose 5SGSMD6N2F45I3LG?

The 5SGSMD6N2F45I3LG positions itself for projects that require substantial programmable logic, significant on-chip RAM, and broad I/O within an industrial temperature profile. Its combination of nearly 583,000 logic elements, approximately 46 Mbits of embedded memory, and 840 I/Os makes it suitable where integration, I/O density, and deterministic electrical characteristics are priorities.

Choose this Stratix V GS device when your design needs a high-density FPGA solution with a defined core voltage window, industrial temperature capability, and a high-pin-count FCBGA package to simplify system-level integration and long-term deployment.

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