5SGSMD6N2F45I2N

The 5SGSMD6N2F45I2N is a Stratix® V GS family Field Programmable Gate Array (FPGA) IC supplied in a 1932‑ball FCBGA package. It provides a high-density programmable fabric with a large embedded memory pool and a high I/O count, suitable for complex, high‑integration digital designs that require industrial temperature operation.

This device operates with a core supply range of 870 mV to 930 mV, is RoHS compliant, and is specified for an operating temperature range of −40 °C to 100 °C, aligning it with industrial-grade deployment requirements described in the product data.

Key Features

• Core capacity  Approximately 583,000 logic elements for implementing large-scale digital logic, state machines, and custom processing pipelines.
• Embedded memory  Approximately 46 Mbits of on‑chip RAM to support frame buffers, lookup tables, FIFOs, and other densely integrated storage needs.
• I/O density  840 user I/Os to support high‑pin‑count interfacing, wide buses, and multiple peripheral/radio links directly to the FPGA fabric.
• Package  1932‑BBGA (FCBGA) in a 1932‑FBGA, FC (45×45) supplier package, providing high pin count in a compact BGA footprint for system‑level integration.
• Power  Core supply range of 870 mV to 930 mV for the device core domain as specified in the product data.
• Temperature and grade  Industrial temperature grade rated from −40 °C to 100 °C to support deployment in extended temperature environments.
• Regulatory  RoHS compliant, meeting common regulatory requirements for lead‑free assembly.

Unique Advantages

• High logic density: Approximately 583,000 logic elements enable complex designs and higher integration, reducing the need for multiple devices.
• Significant embedded RAM: Roughly 46 Mbits of on‑chip memory supports large buffers and data‑intensive logic without immediate external memory dependence.
• Extensive I/O capability: 840 I/Os provide flexibility for interfacing to many peripherals, parallel buses, and multi‑lane connections.
• Industrial temperature rating: Specified for −40 °C to 100 °C to accommodate designs that require extended temperature operation.
• Compact, high‑pin package: 1932‑ball FCBGA (45×45) enables high‑density routing and board‑level integration for complex systems.
• Controlled core voltage: Narrow core supply range (870–930 mV) supports predictable power design and margining for core domains.

Why Choose 5SGSMD6N2F45I2N?

The 5SGSMD6N2F45I2N brings together large logic capacity, substantial on‑chip RAM, and extensive I/O in a single Stratix V GS FCBGA package, making it appropriate for high‑integration FPGA designs requiring industrial temperature operation and high pin counts. Its specified core voltage range and RoHS compliance make it straightforward to integrate into modern power and manufacturing flows.

This device is well suited to engineering teams designing complex digital systems that need embedded memory and dense I/O without partitioning functions across multiple devices, offering a compact package option for board‑level integration.

Request a quote or submit an inquiry for pricing and availability to begin evaluating the 5SGSMD6N2F45I2N for your next project.