5SGSMD6N2F45I2LN

The 5SGSMD6N2F45I2LN is a Stratix® V GS field programmable gate array (FPGA) IC from Intel. This industrial-grade device combines high logic density and substantial on-chip memory with a large I/O count, packaged in a 1932-ball FCBGA (45 × 45) surface-mount package.

Designed for applications that require significant programmable logic, embedded RAM, and extensive I/O connectivity, the device delivers a combination of integration and operating range suitable for demanding industrial environments.

Key Features

• Logic Capacity  Approximately 583,000 logic elements (cells) to implement large-scale digital designs and complex custom logic.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for data buffering, packet processing, and memory-intensive algorithms.
• I/O Density  Up to 840 user I/Os, enabling broad external connectivity and multi-channel interfacing.
• Package  1932-BBGA, FCBGA package (supplier package: 1932-FBGA, FC, 45 × 45) in a surface-mount form factor for compact board-level integration.
• Power  Core voltage supply range of 820 mV to 880 mV to meet the device’s specified operating conditions.
• Temperature Range  Industrial operating temperature rating from −40 °C to 100 °C for deployment in extended-temperature environments.
• Compliance  RoHS compliant to support environmentally conscious designs.
• Documentation  Device family electrical and switching characteristics—including operating conditions, power consumption, and I/O timing—are documented in the Stratix V device datasheet.

Typical Applications

• High-density compute systems  For implementations that require approximately 583,000 logic elements and large embedded memory to consolidate complex logic functions on a single device.
• Multi-channel interfacing  Leverages up to 840 I/Os for designs needing broad connectivity between sensors, peripherals, or parallel data lanes.
• Industrial control and processing  Industrial temperature rating (−40 °C to 100 °C) and surface-mount FCBGA packaging suit robust, space-constrained industrial boards.

Unique Advantages

• High logic integration: The large logic element count enables consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Substantial on-chip memory: Approximately 46.08 Mbits of embedded RAM supports data buffering and on-chip processing without immediate external memory dependence.
• Extensive I/O capability: Up to 840 I/Os provide flexibility for complex system interfaces and high-channel-count designs.
• Industrial temperature rating: Specified −40 °C to 100 °C operation offers suitability for extended-temperature industrial applications.
• Compact FCBGA package: The 1932-ball FCBGA (45 × 45) surface-mount package enables dense PCB layouts while maintaining high pin count.
• Controlled core voltage range: Defined 820 mV–880 mV supply window supports predictable integration with system power rails.

Why Choose 5SGSMD6N2F45I2LN?

The 5SGSMD6N2F45I2LN positions itself for designs that demand high programmable logic capacity, significant embedded memory, and extensive I/O in an industrial-temperature FPGA. Its FCBGA packaging and defined electrical operating parameters make it suitable for integration into compact, high-density boards where reliability across a broad temperature range matters.

For engineers requiring a documented device family with comprehensive electrical and switching characteristics, the Stratix V datasheet provides the necessary details to evaluate power, I/O timing, and operating conditions for system-level design and validation.

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