5SGSMD6N2F45C3G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA

Quantity 804 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSMD6N2F45C3G – Stratix® V GS FPGA, 1932-BBGA FCBGA

The 5SGSMD6N2F45C3G is a Stratix V GS field-programmable gate array (FPGA) IC from Intel offered in a 1932-BBGA (FCBGA) package. It delivers a large logic capacity and substantial embedded memory combined with a high I/O count, targeted for commercial-grade electronic designs.

Key architectural and electrical characteristics follow the Stratix V device family specifications; this device is supplied as a commercial-temperature-grade FPGA with surface-mount packaging and RoHS compliance.

Key Features

  • Logic Capacity  Approximately 583,000 logic elements, enabling complex digital implementations and dense logic designs.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM for large buffering, state storage, and memory-intensive logic functions.
  • I/O Resources  840 device I/Os to support broad interfacing needs across peripherals and board-level signals.
  • Supply Voltage  Core voltage range of 820 mV to 880 mV to match targeted Stratix V power domains.
  • Package & Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount device suitable for standard PCB assembly.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature for commercial-environment deployments.
  • Regulatory  RoHS compliant.
  • Family-Level Electrical Character  Designed according to Stratix V device electrical and switching characteristics as documented in the Stratix V device datasheet.

Unique Advantages

  • Large logic fabric: The ~583k logic elements provide capacity for substantial RTL implementations and complex system integration on a single device.
  • Significant on-chip memory: Approximately 46 Mbits of embedded RAM reduce dependence on external memory for many buffering and state-storage needs.
  • Extensive connectivity: 840 I/Os enable broad peripheral and subsystem interfacing without added I/O expander components.
  • Compact, high-pin-count package: The 1932-BBGA FCBGA package delivers dense pinout and board-level routing efficiency for space-constrained designs.
  • Commercial-grade deployment: Rated for 0 °C to 85 °C operation to match common commercial electronics environments.
  • RoHS compliant: Supports environmentally-conscious manufacturing and regulatory requirements.

Why Choose 5SGSMD6N2F45C3G?

The 5SGSMD6N2F45C3G positions itself for commercial electronic designs that require substantial logic density, large embedded memory, and a high number of I/Os packaged in a compact FCBGA footprint. Its Stratix V family electrical characteristics and commercial temperature rating make it suitable for complex digital systems where on-chip integration reduces board-level components.

Choose this device when your design demands a large, integrated FPGA resource pool with robust I/O capability and significant on-chip RAM, supported by Intel’s Stratix V device documentation and RoHS-compliant manufacturing.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical information for the 5SGSMD6N2F45C3G.

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